Steffen Wiese

Prof. Dr. Steffen Wiese is a full Professor at Saarland University, where he leads the Chair of Microintegration and Reliability. He is actively involved in teaching advanced courses in electronic packaging, reliability engineering, and microintegration for the summer semester of 2025.

His research interests focus on the reliability of electronic systems, particularly failure mechanisms induced by thermal-mechanical stresses. He emphasizes the physics of failure, material deformation behavior, damage modeling, and finite element simulation (FEM) to assess and predict the lifespan of electronic assemblies. His expertise spans electronic manufacturing processes, interconnection technologies, and stochastic methods for reliability evaluation.

Prof. Wiese offers courses such as Assembly and Connection Technology, Reliability I and II, and specialized seminars and project internships in microintegration. He is dedicated to educating students in both theoretical and practical aspects of electronic system reliability, using industry-relevant methodologies and failure analysis techniques.

While no specific scientific awards or publications are listed in the provided material, his role as a professor and chair indicates a significant academic and research contribution to the field of microelectronics reliability.

He advises students through seminar and project internship opportunities, though no named advisees are listed. His work is centered at Saarland University's Campus in Building C6 3, Room -1.19, Saarbrücken.