معرفی
Dr. Hua Lu is a Professor in the Department of Mechanical, Industrial, and Mechatronics Engineering at Toronto Metropolitan University. His research focuses on experimental mechanics and reliability analysis of microelectronic packaging and mechatronic systems. He is affiliated with the Laboratory for Experimental Mechanics Research and actively contributes to advancements in thermal-mechanical performance characterization.
Education:
- BSc, Tianjin University, 1968
- MSc, Tianjin University, 1982
- PhD, Stony Brook University, 1989
Dr. Lu's research interests center on experimental solid mechanics, with emphasis on microelectronic packaging reliability, thermal-mechanical behavior of thin structures, and optical methods for deformation measurement. His work bridges mechanical engineering with electronics manufacturing, focusing on failure prediction and performance optimization of advanced packaging technologies. He applies inverse methods, computer vision, and fiber-optic sensing to real-world reliability challenges in microsystems.
The recent publications highlight a strong trend in developing and applying advanced experimental techniques—particularly inverse modeling, optical diagnostics, and sensor integration—to assess reliability in microelectronics. These works span disciplines including mechanical behavior of materials, thermal analysis, and structural health monitoring, with consistent focus on flip-chip and PBGA technologies.
Professional Affiliations:
- Surface Mounting Technology Association (SMTA) International
Dr. Lu leads the Laboratory for Experimental Mechanics Research, where experimental techniques are developed and applied to structural and electronic system reliability. While specific grant details and student advising records are not listed, his publication record indicates active research supervision and project leadership in experimental mechanics and microelectronics packaging. His work supports innovation in durable, high-performance electronic systems.
