Jürgen Wilde

Prof. Dr.-Ing. Jürgen Wilde is a Professor of Packaging and Interconnection Technology at the Institute of Microsystems Technology (IMTEK), Faculty of Engineering, University of Freiburg. He assumed this C3 professorship on 1 August 1999.

Education:

• Materials Science studies at University of Erlangen-Nuremberg (Diploma in Fracture Mechanics of Composites)
• Doctorate at Clausthal University of Technology on microstructured fiber composites for electronics bonding wires

Research Focus: Wilde's work centers on reliability engineering of electronic assemblies, SMT implementation, metallurgical advancements, and simulation methods (e.g., finite element analysis). Key areas include:

• Environmental-friendly packaging using high-temp thermoplastics
• 3D component integration and protection
• Power electronics design for fuel cell vehicles
• Service life prediction of electrical contacts

He leads research groups in housing technology and design-for-reliability methodologies, collaborating with industry partners like DaimlerChrysler. Professional memberships include DGM, IMAPS, and VDI.