S. Manian Ramkumar

S. Manian Ramkumar serves as Dean of the College of Engineering Technology at Rochester Institute of Technology (RIT), where he also holds a professorial appointment. An RIT alumnus with advanced degrees in engineering, he was appointed permanent dean in May 2019 after serving as interim dean, and actively teaches graduate courses in the Manufacturing & Mechanical Systems Integration program. His leadership focuses on maintaining industry-relevant curricula through close collaboration with corporate advisory boards.

His academic credentials include:

• BE from PSG College of Technology-Bharathiar (India)
• ME from Rochester Institute of Technology
• Ph.D. from State University of New York at Binghamton

Dr. Ramkumar's research centers on electronics packaging reliability, specializing in lead-free soldering processes, thermal management solutions, and novel materials like anisotropic conductive adhesives for advanced packaging. His work addresses critical industry challenges in Package on Package (PoP) technology, drop-test reliability, and thermal shock resistance, with direct applications in consumer electronics manufacturing.

Analysis of his publication record (2010-2014) reveals consistent focus on materials characterization and process optimization for lead-free electronics assembly. Key themes include thermal cycling effects, reflow profile optimization, and mechanical reliability under shock/drop conditions, demonstrating strong industry relevance through partnerships with NASA, General Motors, and electronics manufacturers.

As an active researcher and administrator, he has secured over $600,000 in research funding from diverse sources including NASA, New York State agencies, and industry partners like Alstom Transport and Carestream Health. His leadership extends to editorial roles with IEEE Transactions and organizing committee positions for major conferences including SMTA International and IPC APEX.