Martin Anselm

Dr. Martin Anselm is an Associate Professor in the Department of Manufacturing and Mechanical Engineering Technology at Rochester Institute of Technology's College of Engineering Technology. His research specializes in electronics manufacturing reliability, with emphasis on solder joint performance, thermal cycling effects, low-temperature solder alloys, and surface mount technology (SMT) process optimization.

Key research domains include:

• Thermal and vibration reliability of BGA/LGA solder joints
• Hybrid low-temperature solder systems (e.g., SAC-Bi alloys)
• Stencil printing optimization for fine-pitch components
• Failure analysis of mixed solder alloys
• Correlations between material properties and manufacturing defects

His publications demonstrate strong industry collaboration, particularly with the Surface Mount Technology Association (SMTA), focusing on practical solutions for electronics assembly. He also contributes to engineering education through industry-academia partnership models.