Martin K. Anselm

Martin K. Anselm serves as Interim Department Chair of the Department of Electrical and Computer Engineering Technology within RIT's College of Engineering Technology. Holding a Ph.D. in Materials Science & Engineering from Binghamton University, he brings twelve years of industrial electronics failure analysis experience to his academic role and directs RIT's Center for Electronics Manufacturing.

His educational credentials include:

• BS in Physics from State University College at Geneseo
• MS in Mechanical Engineering from Clarkson University
• Ph.D. in Materials Science & Engineering from Binghamton University

Dr. Anselm's research centers on advanced electronics manufacturing, with primary focus on low-temperature lead-free solder alloy reliability, electronic miniaturization processes, and solder joint microstructural evolution under thermomechanical stress. He additionally leads Photonic Integrated Circuit (PIC) packaging reliability studies funded by NYS and DOD, while developing veteran workforce training programs that have generated significant local industry employment through NYS CFA grants.

Analysis of his 2019-2025 publications reveals dominant themes in solder joint reliability testing under thermal cycling and vibration, with particular emphasis on bismuth-containing hybrid solder systems and low-temperature reflow processes. His work consistently addresses industry pain points in fine-pitch assembly, stencil printing defects, and failure analysis of emerging packaging technologies.

He has secured substantial external funding including NYS Consolidated Funding Application (CFA) grants for veteran training programs and DOD/NYS support for PIC packaging research. As thesis advisor for RMET-788/790 courses, he supervises graduate research while leading academic-industry collaborations like the L3Harris technician training program highlighted in RIT Certified initiatives.

Dr. Anselm directs RIT's Center for Electronics Manufacturing and Assembly (CEMA), which spearheads regional workforce development through events like Chips 101 and partnerships with Upstate New York semiconductor manufacturers. The center focuses on bridging academic research with industry needs in advanced packaging, photonics integration, and electronics manufacturing process optimization.