معرفی
Ian Robertson has been the ninth Dean of the University of Wisconsin-Madison College of Engineering since March 2013. Previously he served as the Donald B. Willett Professor of Engineering and Department Head of Materials Science & Engineering at the University of Illinois at Urbana-Champaign (2003–2009), and as Director of the National Science Foundation Division of Materials Research (2011–2013).
Education
- PhD 1982, Doctor of Metallurgy, University of Oxford
- BS 1978, Applied Physics, Strathclyde University, Glasgow, Scotland
Research Focus
Robertson’s research centres on microstructural evolution in extreme environments. He investigates how stress, strain rate, gaseous and chemical environments, and radiation alter microstructure and, consequently, macro-scale material properties. Key themes include:
- Hydrogen embrittlement mechanisms in steels and nickel alloys
- Radiation damage in concentrated solid-solution and high-entropy alloys
- In situ electron-microscopy studies of dislocation–defect interactions
- Grain-boundary engineering for enhanced radiation tolerance
He has authored more than 240 peer-reviewed publications and is recognized with multiple fellowships and lectureships (ASM, MRS, TMS, AAAS).
Scientific Awards & Honours
- 2021 ASM & TMS Distinguished Lectureship in Materials & Society
- 2016 MRS Fellow
- 2016 TMS Fellow
- 2015 AAAS Fellow
- 2014 ASM Edward DeMille Campbell Memorial Lectureship
- 2009 ASM International Fellow
- DOE Outstanding Scientific Accomplishment Awards (1982, 2011)
- University of Illinois Burnett Teaching Award (1994)
- Donald B. Willett Professorship of Engineering (2005)
College Leadership & Resources
Under Dean Robertson’s leadership, the College of Engineering serves over 4,000 undergraduates and 1,500 graduate students with an annual budget exceeding $200 million. He maintains active affiliations with the Department of Materials Science & Engineering and the Department of Nuclear Engineering & Engineering Physics, and can be reached at engr-dean@engr.wisc.edu.
