جست‌وجوی استاد و پژوهشگر

Subhasish Mitraمشاهده پروفایل

استاد

• Robust Computing
• NanoSystems
• Electronic Design Automation (EDA)
• +۳ مورد دیگر

Subhasish Mitra is the William E. Ayer Professor of Electrical Engineering and Computer Science at Stanford University, holding dual appointments in both departments. He leads the Stanford Robust Systems Group and serves on the leadership team of the Microelectronics Commons AI Hardware Hub under the US CHIPS and Science Act. His research spans Robust Computing, NanoSystems, Electronic Design Automation (EDA), and Neurosciences, with breakthroughs in X-Compact test compression, carbon nanotube computing, and 3D integration. He has held international roles like the Carnot Chair at CEA-LETI and Visiting Professorships globally. Education & Honors: Recipient of over 40 awards including the IEEE Computer Society’s Harry H. Goode Memorial Award, ACM/IEEE’s A. Richard Newton Technical Impact Award, and the Intel Achievement Award. He earned top academic accolades from IIT Kharagpur and Jadavpur University, and is a Fellow of ACM and IEEE. Research Impact: Pioneered first-of-their-kind systems like the carbon nanotube computer and monolithic 3D integration. His work on robust computing techniques like QED validation and X-Compact compression has industry-wide adoption, saving billions in manufacturing costs. Collaborates with industry leaders like Intel, Google, and Samsung. Publications & Grants: Over 400 publications, including award-winning papers in DAC, ISSCC, and IEEE journals. Leads grants from NSF, DoE, and industry partnerships. His lab explores cutting-edge topics like neuromorphic computing, 3D thermal scaffolding, and AI hardware acceleration. Administration & Outreach: Serves as Associate Chair (Faculty Affairs) for Stanford’s Computer Science Department. Recognized by students for mentorship, and frequently invited to global forums like the World Economic Forum and National Academy of Engineering.

Rakesh Kumarمشاهده پروفایل

استاد

• Computer Architecture
• System-Level Design Automation
• Low Power Computing
• +۳ مورد دیگر

Rakesh Kumar is a Professor and John Bardeen Faculty Scholar in the Electrical and Computer Engineering Department at the University of Illinois at Urbana-Champaign. His work focuses on computer architecture, system-level design automation, and low-power computing. PhD in Computer Engineering from University of California, San Diego BS in Electrical Engineering from IIT Kharagpur His research spans all layers of the computing stack, with key contributions to flexible computer systems , waferscale computing , error-resilient architectures , and approximate computing . He has pioneered work on voltage-reliability tradeoffs and peak power management techniques. Recent publications highlight trends in space microdatacenters , printed microprocessors , and neural graph accelerators . His work on plastic chips was recognized as one of the three biggest semiconductor headlines of 2022 by IEEE Spectrum. IEEE Fellow (2024) ISCA Influential Paper Award MICRO Test-of-Time Award ICCAD Ten Year Retrospective Most Influential Paper Award Best Paper Awards at CASES, SELSE, HPCA He has received teaching accolades including the Stanley H. Pierce Faculty Award and Ronald W. Pratt Outstanding Teaching Award . His research group explores hardware-software co-design for emerging applications in AI, IoT, and sustainable computing.

Peter Teertstraمشاهده پروفایل

دانشیار

• Thermal Engineering
• Heat Transfer Modeling
• Electronics Cooling
• +۳ مورد دیگر

Peter Teertstra is an Associate Professor, Teaching Stream in the Department of Mechanical and Mechatronics Engineering at the University of Waterloo and Director of the Sedra Student Design Centre. He holds a PhD (2003), MASc (1992), and BSE (1990) from the University of Waterloo and Calvin College, respectively. His research focuses on thermal modeling for microelectronics/optoelectronics cooling, experimental heat transfer in micro/nano-scale systems, and predicting air cooling limits in electronics. He oversees the Sedra Student Design Centre, supporting teams in competitions through resource access and sponsorship. Teertstra teaches courses like GENE 199, ME 101, MTE 201, and PD 21, emphasizing engineering practice and thermodynamics. His publications (2006–2011) address thermal conductivity in fuel cells, convection modeling, and heat transfer in electronics enclosures. He is currently accepting graduate applications via an online process.

H.-S. Philip Wongمشاهده پروفایل

استاد

• Nanotechnology
• Semiconductor Technology
• Solid-State Devices
• +۵ مورد دیگر

H.-S. Philip Wong is the Willard R. and Inez Kerr Bell Professor in the School of Engineering at Stanford University, where he has been since 2004. He holds the rank of Professor in the Department of Electrical Engineering and serves as the Director of the Stanford Nanofabrication Facility. Prior to Stanford, he spent 16 years at IBM’s T.J. Watson Research Center and served as Vice President of Corporate Research at TSMC (2018–2020), remaining as Chief Scientist in an advisory role thereafter. Leadership roles include founding the Stanford SystemX Alliance and leading the Microelectronics Commons AI Hardware Hub funded by the CHIPS Act. Research focuses on nanotechnology, semiconductor devices, and next-generation computing architectures, including carbon nanotube electronics, 3D integration (N3XT/MOSAIC), and neuromorphic computing. Awarded IEEE Fellow (2001), the IEEE Andrew S. Grove Award, and the J.J. Ebers Award for contributions to electron devices. His work spans device physics, fabrication, and system integration, with over 600 publications. Key contributions include advancements in phase-change memory, carbon nanotube transistors, and compute-in-memory systems. He advises numerous students and collaborates with industry through initiatives like the Stanford Non-Volatile Memory Technology Research Initiative. Recent efforts emphasize AI hardware acceleration, cryo-CMOS for quantum computing, and scalable memory architectures. His lab innovations include CellChips for synthetic biology and hyperdimensional computing using 3D RRAM.

• Microelectronics
• Nanotechnology
• RF Engineering
• +۳ مورد دیگر

Prof. Dr. Amelie Hagelauer holds a professorship in Micro- and Nanosystem Technology at the TUM School of Computation, Information and Technology, Technical University of Munich. Her work focuses on advanced electronics and systems integration across quantum computing hardware, resistive memory technologies, and high-frequency RF systems. She has contributed to innovations in superconducting qubit readout architectures, multi-level RRAM designs, and 3D-integrated CMOS-compatible quantum devices. Research interests span quantum hardware design, nanoelectronic devices, RF front-end systems, and emerging memory technologies. Her work emphasizes practical implementation challenges such as low-power operation, high-voltage handling in RF switches, and wafer-scale fabrication processes. Recent projects include D-band radar systems, energy-efficient 60 GHz transceivers, and antenna tuning solutions for 5G applications. Publications from 2023-2025 showcase advancements in resistive switching device characterization, mitigation of TLS losses in superconducting qubits, and reconfigurable AI accelerators using RRAM-based digital twins. Her work bridges theoretical device physics with practical integrated circuit design, addressing scalability and reliability in next-gen electronics. Awards and grants: None explicitly listed in provided texts. Active collaborations include EU-funded projects on quantum computing platforms and TUM's Electronic Photonic Integration initiatives. Leads research teams in microsystem technology with emphasis on cross-disciplinary approaches combining CMOS processes, MEMS, and quantum engineering.

Thomas Zwickمشاهده پروفایل

استاد

• Radio Wave Propagation
• Radio Channel Modeling
• Measurement Techniques
• +۵ مورد دیگر

Prof. Dr.-Ing. Thomas Zwick is a full professor and director of the Institute of High Frequency Engineering and Electronics (IHE) at the Karlsruhe Institute of Technology (KIT). He holds a Dipl.-Ing. (M.S.E.E.) and Dr.-Ing. (Ph.D.E.E.) from the University of Karlsruhe. His career includes roles at IBM Research (2001–2004), Siemens AG (2004–2007 managing automotive radar teams), and KIT since 2007. He leads research in high-frequency technologies, antennas, radar systems, and wireless communications. Research interests include radio wave propagation, antenna design, automotive radar architectures, and millimeter-wave systems. He has authored/co-authored over 400 papers, 20 patents, and received IEEE Fellow status (2018), honorary doctorate from Budapest University (2022), and membership in the Heidelberg Academy and acatech. His work emphasizes integrating sensing and communication systems, 3D-printed RF components, and high-frequency measurement techniques. Teaching focuses on high-frequency engineering, electronic circuits, and radar systems. He oversees the IHE’s laboratories, including the Microwave Engineering Lab and Student Innovation Lab. Recent work explores sub-THz communication, RIS-aided ISAC systems, and beamforming for reduced EMF exposure in urban scenarios.

Ruonan Hanمشاهده پروفایل

استاد

• Terahertz Electronics
• Integrated Circuits
• RF Systems
• +۴ مورد دیگر

Ruonan Han is a Professor of Electrical Engineering and Computer Science at MIT and serves as Associate Director of the Microsystems Technology Laboratories (MTL) and Director of the MIT-MTL Center for Integrated Circuits and Systems . His research focuses on ultra-high-frequency microelectronic circuits , particularly addressing the 'terahertz gap' in sensing, metrology, security, and communication. He leads the Terahertz Integrated Electronics Group at MIT's MTL, established in 2014. Education: B.S. in Microelectronics, Fudan University (2007) M.S. in Electrical Engineering, University of Florida (2009) Ph.D. in Electrical and Computer Engineering, Cornell University (2014) Research Interests: Terahertz (THz) integrated circuits and systems High-frequency CMOS technologies Quantum sensing and magnetometry RF systems for imaging, radar, and molecular sensing Energy-efficient communication systems His work bridges electronic circuits , electromagnetics , and quantum physics , with applications in defense, healthcare, and environmental monitoring. Awards & Recognition: 2023 IEEE SSCS New Frontier Award 2020 NSF CAREER Award 2019 Intel Outstanding Researcher Award 3× IEEE RFIC Best Student Paper Awards (2012, 2017, 2021) Advising & Leadership: Ph.D. advisor to over 10 students (many recipients of MIT MTL Dissertation Awards) Co-advises with Prof. Anantha Chandrakasan and Prof. Tomás Palacios Editorial roles at IEEE Transactions on Quantum Engineering and VLSI Systems Technical committee member for ISSCC, RFIC, and IMS Labs & Teams: Terahertz Integrated Electronics Group at MIT MTL: Focuses on chip-scale THz systems, quantum devices, and next-generation RF circuits Collaborations with industry (e.g., Apple, MediaTek) and academic groups (e.g., D. Englund's lab at MIT)

Stéphanie P. Lacourمشاهده پروفایل

استاد

• Bioelectronics
• Neuroprosthetics
• Soft Electronics
• +۹ مورد دیگر

Stéphanie P. Lacour is a Full Professor at the School of Engineering, École Polytechnique Fédérale de Lausanne (EPFL), where she holds the Foundation Bertarelli Chair in Neuroprosthetic Technology. She leads the Laboratory of Soft Bioelectronic Interfaces (LSBI) and is affiliated with multiple departments including INX-STI, STI-SMT, SV-SSV, and AVP-DLE-EDOC. Since 2025, she has served as EPFL’s Vice-President for Support to Strategic Initiatives, overseeing institutional research strategy. Her research is centered at Campus Biotech in Geneva, where she was the founding director of the Neuro-X Institute. PhD in Electrical Engineering, INSA Lyon, France (1998–2001) Postdoctoral Research, Princeton University and University of Cambridge Joined EPFL in 2011 Her research focuses on soft bioelectronic interfaces that seamlessly integrate with biological tissues. She pioneers the development of stretchable, compliant electronics for implantable and wearable applications, using techniques from MEMS and microelectronics adapted to elastomeric substrates. Her work enables long-term, minimally invasive neural interfacing for applications in neuroprosthetics, rehabilitation, and health monitoring. Key innovations include soft electrocorticography arrays, liquid metal sensors, and encapsulation methods for chronic implants. Her recent publications span high-impact journals such as Nature , Science Robotics , Advanced Materials , and Nature Nanotechnology , covering topics like neural stimulation, soft robotics, wireless implants, and hydrogel-based interfaces . The work demonstrates a strong trend toward multimodal, closed-loop, and translational neurotechnologies with real-world clinical potential. Scientific Awards: No scientific awards explicitly mentioned in the provided text. She advises a large cohort of PhD students and postdoctoral researchers, many of whom have completed their theses under her supervision. Her team has received funding for projects in neural interfacing, bioelectronics, and soft robotics. She is actively involved in teaching courses such as Soft Microsystems Processing and Devices and Neural Interfaces . Lacour leads the Laboratory of Soft Bioelectronic Interfaces (LSBI) , a multidisciplinary research team focused on the fabrication, characterization, and in vivo evaluation of soft bioelectronic systems. The lab collaborates extensively across EPFL and with clinical partners to translate technologies from bench to bedside.

• Analog Integrated Circuits
• Power-Conditioning ICs
• Energy-Harvesting ICs
• +۳ مورد دیگر

Gabriel Alfonso Rincon-Mora is the Motorola Solutions Foundation Professor at the Georgia Institute of Technology's School of Electrical and Computer Engineering. A Fellow of the National Academy of Inventors, IEEE, and IET, he specializes in analog/power integrated circuits, energy-harvesting systems, and microelectronics. With over 200 articles, 44 patents, and 12 books, his work has produced 26 commercial power-chip products. His research spans: Analog and power-management ICs for efficient energy conversion Self-sustaining microsystems powered by thermal, mechanical, and environmental sources Nano-scale circuit designs for biomedical and wireless sensor applications Recent publications focus on piezoelectric energy harvesting, battery charging optimization, and low-power CMOS designs, demonstrating consistent innovation in power efficiency and miniaturization. Awards include the IEEE Charles A. Desoer Technical Achievement Award, National Hispanic in Technology Award, and recognition as one of "The 100 Most Influential Hispanics." He directs research in power IC design and mentors students through the Georgia Tech Analog Consortium. His laboratory develops integrated solutions for energy-constrained applications, including collaborations with industry partners like Texas Instruments.

• Microelectronics
• Semiconductor Packaging
• Materials Science
• +۳ مورد دیگر

Shenyi Liu is a Doctoral Researcher at Aalto University's Department of Electrical Engineering and Automation , focusing on advanced semiconductor packaging and reliability engineering. Active in the Electronics Integration and Reliability research group, Liu contributes to developing innovative interconnect solutions for MEMS and power electronics. Email: shenyi.liu@aalto.fi Research Interests center on low-temperature bonding technologies , 3D packaging architectures , and failure mechanism analysis in electronic components. Key methodologies include solid-liquid interdiffusion (SLID) bonding and thermal-mechanical stress characterization. Publication Trends show expertise in MEMS integration , interconnect reliability , and power component packaging , with recent work addressing TSV interconnects, die-attach fatigue cracks, and Cu-Sn-In bonding systems. Collaborations span materials engineering and applied physics domains.

Ye (Sarah) Sunمشاهده پروفایل

دانشیار

• Wearable sensors
• Wearable robotics
• Smart and connected health
• +۳ مورد دیگر

Ye (Sarah) Sun is an Associate Professor in the Department of Mechanical Engineering at the University of Virginia (UVA), part of the School of Engineering and Applied Science. She joined UVA in 2021 after serving as an Associate Professor at Michigan Technological University. Her work focuses on wearable sensors, robotics, smart health systems, and cyber-physical systems. She leads the WEARLab research group. Education: Ph.D. in Electrical Engineering from Case Western Reserve University (2021), B.S. in Instrumentation Engineering from Tianjin University (not specified). Research interests include wearable electronics, health monitoring, and human-technology interaction. Her interdisciplinary approach integrates engineering innovations with healthcare applications. Notable projects involve self-powered triboelectric sensors and optical fiber-based health monitoring systems. Recent publications highlight advancements in photodiode technologies for high-frequency applications, including millimeter-wave generation and photonic integrated circuits. Awards include the NSF CAREER Award (2018) and NSF BRITE Award (2022). She has organized major conferences and holds editorial roles in health technology journals. Grants include NSF funding for cyber-physical systems and smart health initiatives. Her lab collaborates on projects involving wearable robotics and connected health solutions, with a focus on real-world applications in healthcare and IoT.

Mervi Paulasto-Kröckelمشاهده پروفایل

استاد

• Electronics Integration
• Reliability Engineering
• Microelectromechanical Systems (MEMS)
• +۸ مورد دیگر

Mervi Paulasto-Kröckel is a Professor in the Department of Electrical Engineering and Automation at Aalto University, specializing in Electronics Integration and Reliability. With a doctoral degree in Engineering and Technology from Helsinki University of Technology (1995) and a Master's degree from the same institution (1990), her work focuses on microelectronics packaging, MEMS, and sustainable electronic manufacturing. Doctoral Degree: Engineering and Technology, Helsinki University of Technology (1995) Master's Degree: Engineering and Technology, Helsinki University of Technology (1990) Her research explores advanced packaging techniques like SLID bonding, reliability of microbumps, and thermally conductive materials. Recent work includes buried aluminum nitride for silicon-on-insulator and fatigue crack analysis in IGBT modules. Her publications emphasize low-temperature processes, interdiffusion, and MEMS reliability. Awards include the JVST A Best ALD Paper Award (2021) and a Best paper award (2000). She leads projects like PowerizeD and 3DPiezoMems, focusing on digitalization and 3D MEMS development. Best paper award (2000) JVST A Best ALD Paper Award (2021)

John D. Cresslerمشاهده پروفایل

استاد

• Silicon-Germanium Heterojunction Bipolar Transistors (SiGe HBT)
• Mixed-Signal Semiconductor Devices
• RF and Microwave Circuit Design
• +۵ مورد دیگر

Professor John D. Cressler is a tenured faculty member at the Georgia Institute of Technology, holding a position within the School of Electrical and Computer Engineering in the College of Engineering. His research focuses on cutting-edge semiconductor technologies, particularly silicon-germanium heterojunction bipolar transistors (SiGe HBTs) for mixed-signal applications spanning RF, microwave, mm-wave, analog, and digital domains. His research interests center on atomic-scale bandgap engineering for next-generation semiconductor devices, with emphasis on SiGe HBT technology development, radiation-hardened circuits for space applications, cryogenic electronics, and device-circuit interactions. His team explores fundamental device theory, broadband noise analysis, profile optimization, 2-D/3-D simulation, compact modeling, and radiation effects. Current projects include Europa-surface mission electronics, D-band/sub-THz systems, and radiation-tolerant receiver designs. Analysis of his 15 most recent publications (2024-2025) reveals a dominant focus on radiation-hardened electronics for space applications (40% of works), millimeter-wave circuit design (30%), and SiGe HBT reliability optimization (30%). Key trends include Europa mission electronics development, D-band/sub-THz circuit innovation, and advanced radiation mitigation techniques using SiGe BiCMOS technology. Professor Cressler teaches multiple courses including ECE 3040 (Microelectronic Circuits), ECE 3450 (Semiconductor Devices), ECE 6444 (Silicon-Based Heterostructure Devices and Circuits), and the interdisciplinary IAC 2002 course on Science, Engineering and Religion. His research is supported by industrial collaborations and Georgia Tech facilities including the Georgia Electronic Design Center (GEDC), NanoTECH, and C-STAR.

• Machine Learning in Electronics
• Electrostatic Discharge (ESD) Protection
• Circuit Reliability
• +۳ مورد دیگر

Elyse Rosenbaum is the Melvin and Anne Louise Hassebrock Professor in Electrical and Computer Engineering at the University of Illinois at Urbana-Champaign. She also serves as the Acting Associate Dean for Research at the Grainger College of Engineering. She is the director of the NSF-supported Center for Advanced Electronics through Machine Learning (CAEML), a collaboration between the University of Illinois, North Carolina State University, and Penn State University. Education: Ph.D. in Electrical Engineering, University of California, Berkeley, 1992 M.S. in Electrical Engineering, Stanford University B.S. in Electrical Engineering, Cornell University (with distinction) Research Interests: Her research focuses on machine learning applications in electronics, ESD-robust high-speed I/O circuit design, compact modeling, behavioral modeling of circuits, and CDM-ESD protection for advanced packaging technologies. Scientific Awards: IEEE Fellow for contributions to electrostatic discharge reliability of integrated circuits Best Student Paper Award, IEDM Outstanding and Best Paper Awards, EOS/ESD Symposium Technical Excellence Award, SRC NSF CAREER Award IBM Faculty Award ESD Association’s Industry Pioneer Recognition Award Advising and Grants: She supervises graduate and undergraduate researchers, primarily focusing on those with strong academic records and relevant experience. Her work is supported by NSF and other prominent organizations. Labs and Teams: She leads the CAEML center, which aims to apply machine learning to optimize microelectronic circuits and systems, enhancing design automation and reliability.

Suresh K. Sitaramanمشاهده پروفایل

استاد

• Computer-Aided Engineering
• Manufacturing
• Micro & Nano Engineering
• +۷ مورد دیگر

Suresh K. Sitaraman is a Regents' Professor and Morris M. Bryan, Jr. Professor in Mechanical Engineering at the Georgia Institute of Technology's George W. Woodruff School of Mechanical Engineering. His primary research focuses on Computer-Aided Engineering (CAE) and Design, manufacturing processes, micro/nano engineering, and mechanics of materials. He leads the Computer-Aided Simulation of Packaging Reliability (CASPaR) Lab and is involved in flexible hybrid electronics research through the Flexible Electronics Center . Dr. Sitaraman holds a Ph.D. from The Ohio State University (1989), M.A.Sc. from the University of Ottawa (1985), and B.E. from the University of Madras (1982). His research includes developing novel techniques like fixtureless magnetic actuation for interfacial fracture testing, compliant micro-scale interconnects for stress mitigation, and synchrotron X-ray diffraction analysis for through-silicon vias (TSVs). He has pioneered studies on carbon nanotube forests' mechanical properties and reliability challenges in 3D microsystems. His awards include the NSF CAREER Award (1997-2002), ASME Fellow designation (2004), and Sigma Xi Sustained Research Award (2008). He has authored over 150 publications and holds multiple patents on compliant interconnect technologies and packaging reliability solutions. Key Research Themes: Micro/nano-scale material characterization, physics-based predictive modeling, flexible electronics, 3D integration, and thermal management. Labs/Initiatives: CASPaR Lab ( caspar.gatech.edu ), Flexible Hybrid Electronics Center. Industry Impact: Contributions to semiconductor packaging, wearable electronics, and advanced manufacturing techniques.