معرفی
Shenyi Liu is a Doctoral Researcher at Aalto University's Department of Electrical Engineering and Automation, focusing on advanced semiconductor packaging and reliability engineering. Active in the Electronics Integration and Reliability research group, Liu contributes to developing innovative interconnect solutions for MEMS and power electronics.
- Email: shenyi.liu@aalto.fi
Research Interests center on low-temperature bonding technologies, 3D packaging architectures, and failure mechanism analysis in electronic components. Key methodologies include solid-liquid interdiffusion (SLID) bonding and thermal-mechanical stress characterization.
Publication Trends show expertise in MEMS integration, interconnect reliability, and power component packaging, with recent work addressing TSV interconnects, die-attach fatigue cracks, and Cu-Sn-In bonding systems. Collaborations span materials engineering and applied physics domains.
