Ganesh Subbarayan

Ganesh Subbarayan is the James G. Dwyer Professor of Mechanical Engineering at Purdue University, affiliated with the School of Mechanical Engineering. His roles include leading the Institute for Advanced System Integration and Packaging (ASIP) and the Center for Heterogeneous Integration Research in Packaging (CHIRP). He holds a B.Tech. from IIT, and M.S. and Ph.D. from Cornell University.

His research focuses on computational and experimental solid mechanics, particularly in fatigue, fracture, and multi-physics phase evolution. Key areas include advanced electronics packaging, solder joint reliability, and thermomechanical behavior. Techniques employed include Finite Element Analysis (FEA), Isogeometric Analysis (IGA), and machine learning for multiphysics modeling.

Recent work emphasizes heterogeneous integration challenges, real-time thermal simulations, and non-destructive material characterization. His publications span 20+ years, addressing topics like solder microstructure evolution, electromigration, and thermal management in 3D packaging.

Prof. Subbarayan has contributed to over 100 peer-reviewed articles and holds leadership in interdisciplinary research initiatives at Purdue. His lab, HiDAC, develops novel methods for analyzing complex material systems.