Bahgat G. Sammakia

Bahgat G. Sammakia is a Distinguished Professor of Mechanical Engineering and Vice President for Research at Binghamton University (SUNY). He leads multiple research centers including S3IP (a NY State Center of Excellence), the Energy-Smart Electronic Systems (ES2) NSF IUCRC, and CHIRP (Center for Heterogeneous Integration Research in Packaging). His roles also include former interim President of SUNY Polytechnic Institute and former IBM senior technical staff member.

Education: B.S. from the University of Alexandria, M.S. and Ph.D. from SUNY Buffalo. Post-doctoral fellowship at the University of Pennsylvania (1982–1983).

Research focuses on heat transfer, electronics packaging, data center thermal management, and heterogeneous integration. He pioneered cooling solutions for high-density electronics and data centers, emphasizing energy efficiency and thermal reliability.

Award highlights include the 2020 Heat Transfer Memorial Art Award (ASME), Fellowships in the National Academy of Inventors (2016), IEEE (2013), and ASME (1997). He holds 21 U.S. patents and over 250 peer-reviewed publications.

Leadership in S3IP and CHIRP drives innovation in microelectronics and advanced packaging. His work bridges academic research with industry applications, addressing global challenges in semiconductor cooling and energy-smart systems.