David Allen

Dr. David Allen is a Lecturer in the Department of Electronic Engineering and Communications at the Technological University of the Shannon: Midlands Midwest (engCORE). His research focuses on material science and electronic engineering, particularly in X-ray diffraction analysis, silicon wafer damage mechanisms, and nanoindentation effects. He holds a PhD from Dublin City University (2014) and a Master of Arts in Teaching and Learning from Institute of Technology Carlow (2020). His work examines crack propagation in silicon wafers under thermal stress and indentation-induced defects, using advanced imaging techniques like synchrotron X-ray topography and microdiffraction.

Education:

• PhD in Analysis of Silicon Wafer Damage (Dublin City University, 2009–2013)
• Masters in Teaching and Learning (Institute of Technology Carlow, 2019–2020)
• Bachelor of Engineering in Electronic Engineering (Institute of Technology Tallaght, 1995–2005)

Research interests include X-ray diffraction, silicon wafer integrity, and material defect analysis. His articles explore topics like stress-strain fields in silicon, crack formation via indentation, and thermal stress effects. He contributed to organizing the Digital Education Conference 2024 as part of the program committee.