Tiwei Wei

Tiwei Wei is an Assistant Professor of Mechanical Engineering at Purdue University's School of Mechanical Engineering, located in West Lafayette, Indiana. He leads the Semiconductor Packaging Laboratory (S-PACK) and holds an IEEE Senior Member designation (2024). His research focuses on thermal management in advanced semiconductor systems, electronic cooling, and materials development for high-power applications.

Education includes a Postdoc at Stanford University (2022), Ph.D. from IMEC & KU Leuven (2020), and prior researcher roles at Tsinghua University and HKUST. He also holds an M.S. from a joint program between Chongqing University of Posts and Telecommunications and Tsinghua University (2012).

Research interests span heat transfer in semiconductor interconnects, microfluidic cooling for extreme thermal fluxes, and reliability modeling. His work integrates computational engineering, nanotechnology, and advanced materials science. Key contributions include polymer-based microjet cooling solutions and 3D printed thermal management systems.

Notable awards include the 2024 Intel Rising Star Faculty Award and the IMEC Ph.D. Excellence Award (2020). He has organized major conferences including General Chair for IEEE EPS REPP (2024) and Track Chair roles at ASME and IEEE events.

Professional leadership includes founding the IEEE EPS Central Indiana chapter and serving on executive committees for Silicon Valley and global IEEE-EPS chapters. His lab focuses on advancing semiconductor packaging technologies for next-generation electronics.