معرفی
Ravinder Dahiya is a Professor in the Department of Electrical and Computer Engineering at Northeastern University's College of Engineering. He is also an Affiliated Researcher at the Dublin Innovation Institute. His research focuses on flexible printed electronics, soft robotics, electronic skin, and sustainable technologies, emphasizing biodegradable materials and energy-efficient systems.
Education: PhD in Microelectronics from the Italian Institute of Technology (2009). Awards include Fellowships from IEEE, The Royal Society of Edinburgh, and The Institution of Engineers in Scotland, alongside the Microelectronic Engineering Young Investigator Award (2016).
Research interests span tactile sensing, haptics, and wearable systems, with a lab (BEST Group) developing multidisciplinary solutions for societal challenges like electronic waste reduction. Key projects include self-powered energy harvesters and biodegradable triboelectric nanogenerators.
Recent grants include a $230,000 NSF EAGER award for robotic e-skin integration. Media highlights include features in TechXplore and Chemical & Engineering News, along with speaking roles at global summits like the AI for Good Global Summit (2023).
Labs/Teams: Bendable Electronics and Sustainable Technologies (BEST) Group, focusing on printed electronics, material science, and robotics.
