Markus Feißt

M.Sc. Markus Feißt is a scientific research associate at the Department of Packaging Technology at the Albert-Ludwigs-Universität Freiburg. He holds a Master's degree in Microsystems Engineering from the same university. His research focuses on transient liquid phase bonding (TLP) for sensors in high-temperature environments, building on his prior work in MEMS processes and sensor fusion. He has contributed to developing test chips for mechanical stress analysis in power electronics components.

• Affiliation: Faculty of Engineering, Department of Packaging Technology
• Education: M.Sc. Microsystems Engineering (2016), B.Sc. Microsystems Engineering (2013)

His research interests include advanced joining technologies for microsystems, sensor integration, and materials characterization under extreme conditions. Feißt’s work bridges fundamental materials science with practical applications in high-performance electronic packaging.