Anish Rao Lakkaraju

Anish Rao Lakkaraju is a Postdoctoral Researcher in the Department of Civil and Mechanical Engineering at the Technical University of Denmark (DTU), specializing in Materials and Surface Engineering. His research focuses on the reliability of electronic components, particularly examining failure mechanisms related to environmental factors.

Dr. Lakkaraju's research interests span Corrosion Science, Materials Engineering, and Printed Circuit Board Reliability, with specific expertise in humidity effects on electronics, surface science phenomena, and dendritic growth mechanisms. His work addresses critical challenges in electronic packaging reliability under various environmental stressors.

His recent publication record demonstrates expertise in PCB reliability, with a focus on water film formation, solder flux interactions, and dendritic growth mechanisms. The research shows a consistent trajectory toward developing predictive models for humidity-induced failures in electronic assemblies, with increasing emphasis on practical design strategies for improved reliability.

As a recently completed PhD graduate (2024), he has established himself as an emerging researcher in electronic materials reliability, with publications in high-impact journals including Corrosion Science and IEEE Transactions on Components, Packaging and Manufacturing Technology.

Dr. Lakkaraju has presented his research at international conferences, demonstrating active engagement with the scientific community. His work is conducted within DTU's research ecosystem focusing on materials science and engineering applications for electronic systems.