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Muhannad S BakirView profile

Professor

• Heterogeneous Integration
• 3D IC Packaging
• Advanced Cooling Systems
• +7 more

Muhannad S. Bakir is the Dan Fielder Professor in the School of Electrical and Computer Engineering at Georgia Institute of Technology and serves as the Director of the 3D Systems Packaging Research Center. His research focuses on heterogeneous integration of microsystems, including 2.5D and 3D ICs and packaging technologies, with significant contributions to advanced cooling systems, electrical and photonic interconnects, and biosensor integration with CMOS. Dr. Bakir's research interests span heterogeneous microsystem design and integration, advanced cooling and power delivery for emerging architectures, electrical and photonic interconnect technologies, biosensor technologies, and nanofabrication. His work addresses critical challenges in next-generation electronics, enabling polylithic integration that concatenates heterogeneous ICs of various functionalities while mimicking monolithic-like densities. His research particularly focuses on co-design of thermal technologies, power delivery networks, and signaling networks for silicon nanoelectronic systems. His recent publications demonstrate strong trends in fused-silica stitch-chip technology for heterogeneous integration, with particular emphasis on RF and mm-wave applications, power delivery for AI accelerators, and thermal management solutions. His work bridges electrical engineering, materials science, and thermal management to solve critical bottlenecks in computing performance and efficiency. 2013 Intel Early Career Faculty Honor Award 2012 DARPA Young Faculty Award 2011 IEEE CPMT Society Outstanding Young Engineer Award 2012 National Academy of Engineering Frontiers of Engineering Symposium Invited Participant 2015 IEEE CPMT Society Distinguished Lecturer 2014 Best Paper of the IEEE Transactions on Components Packaging and Manufacturing Technology More than 25 conference and student paper awards Twelve issued US Patents Dr. Bakir leads the Integrated 3D Systems Lab (I3DS) at Georgia Tech, which is actively researching advanced packaging, interconnects, electrical and thermal design, and system integration. His team has received significant recognition for their work, including multiple best paper awards from major conferences like ECTC, IITC, and CICC. The lab is currently seeking postdoctoral researchers and research faculty to advance next-generation electronics through collaborative research. His lab focuses on enabling the next phase of Moore's Law through polylithic integration, which concatenates heterogeneous ICs of various functionalities (digital, analog, photonic, and mm-wave) using advanced off-chip '2.5D' and '3D' heterogeneous interconnects and packaging. This work impacts applications in high-performance computing, machine learning, edge intelligence, autonomous vehicles, augmented/virtual reality, and healthcare.

Jonathan KlamkinView profile

Professor

• Integrated Photonics
• Silicon Photonics
• Optical Communications
• +5 more

Jonathan Klamkin is a Professor in the Department of Electrical and Computer Engineering at the University of California, Santa Barbara (UCSB). He also serves as the Director of the Nanofabrication Facility, overseeing advanced photonics fabrication resources. His research focuses on integrated photonics, silicon photonics, optical communications, and compound semiconductor integration. Klamkin holds a PhD in Materials from UCSB, an MS in Electrical and Computer Engineering from UCSB, and a BS in Electrical and Computer Engineering from Cornell University. His research interests span cutting-edge areas such as electronic-photonic integration, nanophotonics, and microwave photonics. He has pioneered techniques for heterogeneous integration of compound semiconductors on silicon, enabling scalable photonic systems for applications in LiDAR, high-speed communications, and quantum technologies. Notable awards include the DARPA Young Investigator Award, NASA Early Career Faculty Award, and the PIERS Young Scientist Award. His recent work emphasizes beam steering systems, high-power quantum dot lasers, and photonic integrated circuits for remote sensing and lidar. Klamkin’s lab develops both fundamental materials science and applied photonic devices, with a focus on bridging the gap between semiconductor growth and integrated system design. Key contributions include innovations in grating coupler design, antiphase boundary-free epitaxy for GaAs on silicon, and analog coherent detection for energy-efficient data centers. His research bridges photonics, electronics, and materials science to address challenges in high-performance integrated systems.

Zoya PopovicView profile

Professor

• High-Efficiency Circuits
• Microwave Technology
• Millimeter-Wave Imaging
• +3 more

Zoya Popovic is a Distinguished Professor and holds the Lockheed Martin Endowed Chair in RF Engineering at the University of Colorado Boulder's Department of Electrical, Computer, and Energy Engineering. She earned a Dipl.Ing. from the University of Belgrade (1985) and a PhD from Caltech (1990). She has advised over 50 PhD students and was a visiting professor at Technical University of Munich (2001). Her research focuses on high-efficiency microwave/millimeter-wave circuits, smart antenna arrays, wireless powering systems, and biomedical microwave applications. Notable contributions include quasi-optical imaging techniques and low-noise amplifier designs. Key awards: IEEE Microwave Prizes (1993/2006), Humboldt Research Award (2000), Terman Medal (2001) Lab Group Website: [Link] Recent work emphasizes in-band full-duplex systems, GaN MMICs, and quantum-based waveform modulation. Her group maintains advanced facilities for millimeter-wave and terahertz research.

• Computer Architecture
• Computer Hardware
• Energy Efficiency
• +4 more

Nam Sung Kim is the W. J. "Jerry" Sanders III-Advanced Micro Devices Inc. Endowed Chair and holds a Professorship in Electrical and Computer Engineering at the University of Illinois. He is also affiliated with the Siebel School of Computing and Data Science, Coordinated Science Lab, and National Center for Supercomputing Applications (NCSA). His research focuses on computer architecture, memory systems, chiplet integration, and hardware security. Key areas include energy-efficient computing, processing-in-memory (PIM), and mitigating hardware vulnerabilities like rowhammer attacks. Kim has received prestigious awards including IEEE Fellow (2016), MICRO Hall of Fame (2018), NAI Fellow (2023), and NSF CAREER Award (2015). His work spans publications in top venues like ASPLOS and IEEE journals, addressing topics such as CXL-based memory systems, DRAM module optimization, and GPU architecture improvements. Collaborations emphasize interdisciplinary research in hardware-software co-design and emerging technologies. His labs and teams at Coordinated Science Lab and NCSA drive innovations in scalable computing, near-memory processing, and cloud infrastructure for AI workloads. Ongoing projects include developing resilient memory hierarchies and accelerating large-scale machine learning models through novel architecture designs.

Azita EmamiView profile

Professor

• Mixed-signal Integrated Circuits
• Silicon Photonics
• Biomedical Devices
• +4 more

Azita Emami serves as the Andrew and Peggy Cherng Professor of Electrical Engineering and Medical Engineering at the California Institute of Technology (Caltech), where she concurrently holds leadership roles as Executive Officer for Electrical Engineering and Director of the Center for Sensing to Intelligence. Appointed to Caltech's faculty in 2007, she progressed from Assistant Professor to her current endowed professorship through demonstrated scholarly excellence. Her academic foundation includes: B.S. in Electrical Engineering from Sharif University of Technology (1996) M.S. in Electrical Engineering from Stanford University (1999) Ph.D. in Electrical Engineering from Stanford University (2004) Professor Emami pioneers mixed-mode integrated circuit systems that bridge theoretical innovation with practical applications. Her research emphasizes ultra-low power consumption and high reliability in scalable semiconductor technologies, targeting transformative solutions across multiple domains. Key thrusts include: Biomedical implantables for neural recording/stimulation and gastrointestinal monitoring Photonics-electronics co-design for energy-efficient optical interconnects Machine learning-enhanced signal processing for brain-computer interfaces Miniaturized magnetic sensors with unprecedented noise performance Her work consistently demonstrates how circuit-level innovations enable breakthrough capabilities in medical diagnostics and high-speed computing. Analysis of her 2021-2024 publications reveals a strategic convergence of biomedical sensing and intelligent signal processing . While maintaining strong contributions to optical interconnects (accounting for ~40% of recent output), her lab increasingly focuses on closed-loop medical systems where low-power analog neural networks interpret physiological signals. This evolution reflects growing NIH and industry interest in implantable/wearable health technologies, with her group leading in CMOS-based sensor miniaturization and energy efficiency. Her professional recognition includes: IEEE Solid-State Circuits Society Distinguished Lecturer appointment Mentorship excellence is evidenced by students receiving prestigious awards including the Jakob van Zyl Predoctoral Research Award (Saransh Sharma, Ryoto Sekine) and Charles Wilts Prize (Kuan-Chang Chen). Her research program leverages strategic partnerships with Heritage Medical Research Institute and industry collaborators, supported through center-based funding like the Center for Sensing to Intelligence. Administrative leadership spans departmental governance (as Executive Officer) and conference organization (ISSCC technical committees). She directs Caltech's Mixed-mode Integrated Circuits and Systems Lab (MICS) , which operates as a nexus for cross-disciplinary innovation between electrical engineering and medical applications. The lab's industry-collaborative framework accelerates translation of circuit concepts into real-world biomedical solutions through the Center for Sensing to Intelligence.

Ruonan HanView profile

Professor

• Terahertz Electronics
• Integrated Circuits
• RF Systems
• +4 more

Ruonan Han is a Professor of Electrical Engineering and Computer Science at MIT and serves as Associate Director of the Microsystems Technology Laboratories (MTL) and Director of the MIT-MTL Center for Integrated Circuits and Systems . His research focuses on ultra-high-frequency microelectronic circuits , particularly addressing the 'terahertz gap' in sensing, metrology, security, and communication. He leads the Terahertz Integrated Electronics Group at MIT's MTL, established in 2014. Education: B.S. in Microelectronics, Fudan University (2007) M.S. in Electrical Engineering, University of Florida (2009) Ph.D. in Electrical and Computer Engineering, Cornell University (2014) Research Interests: Terahertz (THz) integrated circuits and systems High-frequency CMOS technologies Quantum sensing and magnetometry RF systems for imaging, radar, and molecular sensing Energy-efficient communication systems His work bridges electronic circuits , electromagnetics , and quantum physics , with applications in defense, healthcare, and environmental monitoring. Awards & Recognition: 2023 IEEE SSCS New Frontier Award 2020 NSF CAREER Award 2019 Intel Outstanding Researcher Award 3× IEEE RFIC Best Student Paper Awards (2012, 2017, 2021) Advising & Leadership: Ph.D. advisor to over 10 students (many recipients of MIT MTL Dissertation Awards) Co-advises with Prof. Anantha Chandrakasan and Prof. Tomás Palacios Editorial roles at IEEE Transactions on Quantum Engineering and VLSI Systems Technical committee member for ISSCC, RFIC, and IMS Labs & Teams: Terahertz Integrated Electronics Group at MIT MTL: Focuses on chip-scale THz systems, quantum devices, and next-generation RF circuits Collaborations with industry (e.g., Apple, MediaTek) and academic groups (e.g., D. Englund's lab at MIT)

Douglas C. HopkinsView profile

Research Professor

• Power Electronics
• Advanced Packaging
• Wide Band Gap Semiconductors
• +4 more

Douglas C. Hopkins is a Research Professor and Director of the Laboratory for Packaging Research in Electronic Energy Systems (PREES) at North Carolina State University's Department of Electrical and Computer Engineering. He joined the ECE faculty in 2011 and is affiliated with the FREEDM Systems Center and the Center for Additive Manufacturing and Logistics (CAMAL). He holds a Ph.D. in Electrical Engineering from Virginia Tech (1989). His research focuses on Very High-Frequency power electronics, Wide Band Gap (WBG) devices (GaN/SiC), advanced packaging, and solid-state protection systems . He has pioneered work in integrated power electronics, harsh-environment systems, and 3D power electronics integration. His leadership includes founding conferences such as the International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM) and the International Symposium on Advanced Power Electronics Packaging (APEPS). Prof. Hopkins has authored over 200 publications and co-founded DensePower, LLC as CEO/CTO. He serves as Associate Editor for the IEEE Journal of Emerging and Selected Topics in Power Electronics and holds editorial roles in multiple journals. His awards include the IMAPS Outstanding Educator Award (2013) and IMAPS Fellow (2007). He has held visiting appointments at the Army Research Lab, NASA, and Lawrence Livermore National Lab, and served as a National Academy of Sciences reviewer. His consulting firm, DCHopkins & Associates, LLC, provides engineering expertise in power electronics and packaging. Key Contributions: Director of PREES Lab and FREEDM Center member Co-founder of 3D-PEIM and APEPS symposiums IEEE PELS Technical Committee member (TC2, TC-6) Recipient of IMAPS Fellow and multiple conference recognitions

• Machine Learning in Electronics
• Electrostatic Discharge (ESD) Protection
• Circuit Reliability
• +3 more

Elyse Rosenbaum is the Melvin and Anne Louise Hassebrock Professor in Electrical and Computer Engineering at the University of Illinois at Urbana-Champaign. She also serves as the Acting Associate Dean for Research at the Grainger College of Engineering. She is the director of the NSF-supported Center for Advanced Electronics through Machine Learning (CAEML), a collaboration between the University of Illinois, North Carolina State University, and Penn State University. Education: Ph.D. in Electrical Engineering, University of California, Berkeley, 1992 M.S. in Electrical Engineering, Stanford University B.S. in Electrical Engineering, Cornell University (with distinction) Research Interests: Her research focuses on machine learning applications in electronics, ESD-robust high-speed I/O circuit design, compact modeling, behavioral modeling of circuits, and CDM-ESD protection for advanced packaging technologies. Scientific Awards: IEEE Fellow for contributions to electrostatic discharge reliability of integrated circuits Best Student Paper Award, IEDM Outstanding and Best Paper Awards, EOS/ESD Symposium Technical Excellence Award, SRC NSF CAREER Award IBM Faculty Award ESD Association’s Industry Pioneer Recognition Award Advising and Grants: She supervises graduate and undergraduate researchers, primarily focusing on those with strong academic records and relevant experience. Her work is supported by NSF and other prominent organizations. Labs and Teams: She leads the CAEML center, which aims to apply machine learning to optimize microelectronic circuits and systems, enhancing design automation and reliability.

Robert M. Weikle, IIView profile

Professor

• Millimeter-wave electronics
• Terahertz technology
• Applied electromagnetics
• +9 more

Robert M. Weikle, II is a Professor in the Charles L. Brown Department of Electrical and Computer Engineering at the University of Virginia, with a courtesy appointment in the Department of Physics. He earned his B.S. from Rice University (1986), M.S. (1987), and Ph.D. (1992) in Electrical Engineering from Caltech, followed by postdoctoral work at Chalmers University of Technology (1992). His research focuses on millimeter-wave and terahertz electronics , applied electromagnetics, integrated antennas, low-noise sensors, and heterogeneous integration of compound semiconductors. His work bridges electronics and photonics for spectrum access, with applications in astronomy, spectroscopy, and metrology. He has published extensively on micromachined silicon substrates, superconducting materials, and emerging technologies. Scientific Awards: IEEE Microwave Prize (1993) David A. Harrison III Award (1999) University of Virginia All-University Outstanding Teaching Award (2000) Edlich-Henderson Innovator of the Year (2016) Fulbright Scholar (2001) As Chief Technology Officer and co-founder of Dominion Microprobes, Inc., he commercializes micromachined wafer probes for high-frequency metrology. His lab, located in E220 Thornton Hall and the Jesse W. Beams Physics Building, has produced 15+ recent publications on submillimeter-wave devices, THz probes, and calibration techniques.

Fred A. KishView profile

Professor

• Photonics
• Optoelectronic Devices
• Compound Semiconductor Materials
• +3 more

Fred A. Kish is the MC Dean Distinguished Professor and Director of the NC State Nanofabrication Facility at North Carolina State University. He holds a Ph.D. in Electrical Engineering from the University of Illinois at Urbana-Champaign (1992). His research focuses on Photonics, Optoelectronic Devices, and Compound Semiconductor Materials , with emphasis on photonic integrated circuits (PICs), quantum information science, and semiconductor material engineering. He has co-invented foundational technologies for LEDs, VCSELs, and large-scale PICs, contributing over $7B in commercialized products. His leadership includes roles at Hewlett-Packard, Agilent Technologies, and Infinera Corporation, where he pioneered optical communication systems. Dr. Kish is a Fellow of the National Academy of Inventors, Optica, and IEEE, and a member of the National Academy of Engineering. His awards include the IEEE David Sarnoff Award and the John S. Risley Entrepreneur of the Year Award. He has authored 170+ peer-reviewed publications, 135+ patents, and 5 book chapters. His current work drives advancements in wide bandgap semiconductors and photonic integration for next-generation communications and sensors. Labs/Teams: Directs the NC State Nanofabrication Facility, a hub for semiconductor innovation. Collaborates on the CLAWS Hub, a $39.4M CHIPS Act-funded regional semiconductor innovation initiative.

Muhannad S. BakirView profile

Professor

• Heterogeneous Integration
• Electrical and Photonic Interconnects
• Thermal Modeling for Electronics
• +3 more

Muhannad S. Bakir is the Dan Fielder Professor in the School of Electrical and Computer Engineering at Georgia Institute of Technology, and Director of the 3D Systems Packaging Research Center . His research focuses on heterogeneous integration , electrical/photonic interconnects , thermal modeling , and electronics for healthcare , with over 180 publications and 12 U.S. patents. Research areas include: Advanced cooling and power delivery for emerging systems Biosensor-CMOS integration 2.5D/3D IC packaging Polylithic integration technology Nanofabrication for microsystems Scientific accolades include: 2018 IEEE EPS Exceptional Technical Achievement Award 2013 Intel Early Career Faculty Honor Award 2012 DARPA Young Faculty Award 2011 IEEE CPMT Outstanding Young Engineer Award Best paper awards at IEEE ECTC, IITC, and CICC 2020 Georgia Tech Doctoral Thesis Advisor Award His lab explores integrated 3D systems with emphasis on co-design of thermal, power, and electrical networks for machine learning and healthcare applications.

Dushan BoroyevichView profile

Professor

• Power Electronics
• Modular Multilevel Converters
• High-Frequency Switching
• +5 more

Dushan Boroyevich is a University Distinguished Professor at Virginia Tech's Bradley Department of Electrical and Computer Engineering and serves as Deputy Director of the Center for Power Electronics Systems (CPES). He holds adjunct roles at Tsinghua, Xi'an Jiaotong, Zhejiang, and National Cheng-Kung Universities. His research focuses on power electronics systems, including multi-phase power conversion, electronic power distribution, and modular multilevel converters. He pioneered the geometric modeling approach for high-frequency converters and has led over 200 students in generating 1000+ publications and 20 patents. Education: Dipl. Ing. (University of Belgrade, 1976), M.S. (University of Novi Sad, 1982), Ph.D. (Virginia Tech, 1986). Awards include IEEE Fellow, IEEE William E. Newell Award, and election to the U.S. National Academy of Engineering (2014). His CPES leadership has driven global advancements in power electronics integration and modularization. Research emphasizes high-power density, EMI mitigation, and next-gen SiC-based converters. Recent work includes medium-voltage PEBB designs, common-mode noise reduction, and grid-interface systems. He collaborates closely with industry through CPES's 80+ member consortium. Awards: IEEE Fellowships, Owen Distinguished Service Award, European Power Electronics Association Awards Labs/Teams: CPES, Virginia Tech Power Electronics Research Group Grants/Projects: NSF National Engineering Research Center funding, Industry Consortium projects

David WentzlaffView profile

Professor

• Computer Architecture
• Green Computing
• Cloud Computing
• +6 more

David Wentzlaff is a Professor of Electrical and Computer Engineering at Princeton University, with associated faculty roles in Computer Science and the High Meadows Environmental Institute (HMEI). He leads research in computing architecture, green computing, and sustainable system design. As Director of Undergraduate Studies, he shapes educational programs in his field. Education: Ph.D., Electrical Engineering, MIT (2012) M.S., Electrical Engineering and Computer Science, MIT (2002) B.S., Electrical Engineering, University of Illinois at Urbana-Champaign (2000) Research Focus: Future Computing Systems: Designing manycore architectures, cloud computing infrastructure, and chiplet-based systems for exascale computing. Sustainability: Developing energy-efficient hardware, recyclable computing systems, and eco-friendly decommissioning strategies. Hardware-Software Co-Design: Exploring FPGA integration, in-memory computing, and parallel processing frameworks. Advising & Grants: Advises 8 current graduate students, focusing on topics like chiplet design, neural acceleration, and sustainable computing. Recipient of NSF grants for projects like OpenPiton (open-source manycore research platform) and CAREER awards for energy-efficient architectures. Labs & Collaborations: Leads the Wentzlaff Research Group at Princeton. Develops open-source frameworks like PRGA (FPGA prototyping) and OpenPiton (manycore processor).

Kimia Zamiri AzarView profile

Assistant Professor

• Hardware Security
• Verification Formal Methods
• Advanced VLSI Testing
• +3 more

Kimia Zamiri Azar serves as an Assistant Professor in the Department of Electrical and Computer Engineering at the University of Central Florida, focusing on hardware security and verification methodologies. Her research bridges theoretical formal methods with practical security implementations in semiconductor design and testing. Her educational background includes: Ph.D. in Electrical and Computer Engineering, George Mason University (2021) Postdoctoral Research, University of Florida Dr. Azar's research spans hardware security with emphasis on system-level verification, VLSI design-for-trust, and advanced IC testing. She pioneers techniques in logic locking, secure heterogeneous integration, and IC supply chain security, developing frameworks for authenticated encryption in Systems-in-Package and runtime security monitoring. Her work integrates formal verification with innovative testing methodologies to address hardware trust challenges across the semiconductor lifecycle. Analysis of her recent publications reveals two dominant trends: (1) Application of large language models (LLMs) to hardware design tasks including high-level synthesis code generation and RTL optimization, and (2) Advancement of secure heterogeneous integration techniques for System-in-Package architectures with focus on counterfeit prevention and split-test security protocols. These directions address critical gaps in hardware trustworthiness amid increasingly complex semiconductor supply chains. Her scientific contributions have earned significant recognition: Best Paper Award at ICCAD 2019 Best Paper Award at ISVLSI 2020 Best Paper Award at ICCAD 2020 Best Paper Award at IEEE DCAS 2020 Best Paper Award at HOST 2022 Best Paper Award at DATE 2023 Dr. Azar secures substantial research funding from premier agencies including NSF, SRC, DARPA, AFRL, DoD (NG), and Microsemi. Her grants support projects spanning hardware security validation frameworks, secure heterogeneous integration, and AI-augmented verification methodologies. She actively mentors students in her research group, guiding publications in top venues like IEEE D&T, IEEE TC, and DAC while fostering industry-academic collaborations. Her work directly impacts semiconductor security standards through patented innovations and open-source verification tools. As an active IEEE and ACM member, she contributes to community advancement through conference organization (HOST, DATE), journal editorial roles, and workshop leadership on hardware security standards. Her research group collaborates with semiconductor industry leaders to translate theoretical security frameworks into practical design-for-trust methodologies for next-generation integrated circuits.

Albert H. TitusView profile

Professor

• Wearable Sensors
• Biosensors
• Bioinstrumentation
• +5 more

Albert H. Titus is a Professor in the Department of Biomedical Engineering and an Adjunct Professor in the Department of Electrical Engineering at the University at Buffalo, State University of New York. He serves as Associate Vice President for Regulatory Support in the Office of the Vice President for Research and Economic Development. His research focuses on analog VLSI design for neuromorphic visual processing, biosensors, wearable devices, optoelectronic systems, and neural networks. Education: PhD in Electrical and Computer Engineering, Georgia Institute of Technology (1997) MS in Electrical Engineering, University at Buffalo (1991) BS in Electrical Engineering, University at Buffalo (1989) Research Interests: His work spans wearable and implantable sensors, bioinstrumentation, neural network-based visual processing, analog VLSI implementations, optoelectronics, and electronic packaging. He pioneered CMOS-based neuromorphic systems and developed patented technologies for glare sensing and RF power calorimetry. Publication Trends: His recent articles emphasize CMOS-integrated sensors, machine learning for bioimpedance analysis, implantable medical devices, and xerogel-based optical biosensors. These works bridge biomedical engineering and microelectronics. Scientific Recognition: He is a Fellow of the National Academy of Inventors and has received the SUNY Chancellor’s Award for Excellence in Service (2017), NSF CAREER award, and Western New York Inventor of the Year (2010). His inventions include a patented low-power glare sensor (U.S. Patent 7,586,079) featured in Popular Science’s 2011 Top Ten Inventions. Academic Leadership: As a faculty member, he has supervised nearly 20 PhD and over 40 MS students, while teaching courses in circuits, IC design, sensors, and signal processing across electrical and biomedical engineering disciplines.