Muhannad S Bakir

Muhannad S. Bakir is the Dan Fielder Professor in the School of Electrical and Computer Engineering at Georgia Institute of Technology and serves as the Director of the 3D Systems Packaging Research Center. His research focuses on heterogeneous integration of microsystems, including 2.5D and 3D ICs and packaging technologies, with significant contributions to advanced cooling systems, electrical and photonic interconnects, and biosensor integration with CMOS.

Dr. Bakir's research interests span heterogeneous microsystem design and integration, advanced cooling and power delivery for emerging architectures, electrical and photonic interconnect technologies, biosensor technologies, and nanofabrication. His work addresses critical challenges in next-generation electronics, enabling polylithic integration that concatenates heterogeneous ICs of various functionalities while mimicking monolithic-like densities. His research particularly focuses on co-design of thermal technologies, power delivery networks, and signaling networks for silicon nanoelectronic systems.

His recent publications demonstrate strong trends in fused-silica stitch-chip technology for heterogeneous integration, with particular emphasis on RF and mm-wave applications, power delivery for AI accelerators, and thermal management solutions. His work bridges electrical engineering, materials science, and thermal management to solve critical bottlenecks in computing performance and efficiency.

• 2013 Intel Early Career Faculty Honor Award
• 2012 DARPA Young Faculty Award
• 2011 IEEE CPMT Society Outstanding Young Engineer Award
• 2012 National Academy of Engineering Frontiers of Engineering Symposium Invited Participant
• 2015 IEEE CPMT Society Distinguished Lecturer
• 2014 Best Paper of the IEEE Transactions on Components Packaging and Manufacturing Technology
• More than 25 conference and student paper awards
• Twelve issued US Patents

Dr. Bakir leads the Integrated 3D Systems Lab (I3DS) at Georgia Tech, which is actively researching advanced packaging, interconnects, electrical and thermal design, and system integration. His team has received significant recognition for their work, including multiple best paper awards from major conferences like ECTC, IITC, and CICC. The lab is currently seeking postdoctoral researchers and research faculty to advance next-generation electronics through collaborative research.

His lab focuses on enabling the next phase of Moore's Law through polylithic integration, which concatenates heterogeneous ICs of various functionalities (digital, analog, photonic, and mm-wave) using advanced off-chip '2.5D' and '3D' heterogeneous interconnects and packaging. This work impacts applications in high-performance computing, machine learning, edge intelligence, autonomous vehicles, augmented/virtual reality, and healthcare.