About
Rao Tummala is a Distinguished and Endowed Pettit Chair Professor at Georgia Tech's College of Engineering, with joint appointments in Electrical and Computer Engineering and Materials Science and Engineering. He founded and directs the NSF-funded Microsystems Packaging Research Center (PRC), focusing on System-on-Package (SOP) innovations as the 'Second Law of Electronics.' The center involves 200 students, 15 faculty, and 40 global companies.
Research interests span advanced packaging technologies, including:
- Glass-based RF modules for 5G/6G applications
- Polymer dielectrics for high-density interconnects
- Embedded power passives and 3D integration
- Nanocopper sintering for heterogeneous integration
- Millimeter-wave antenna-in-package designs
Awards and honors include:
- National Academy of Engineering membership
- IEEE Third Millennium and David Sarnoff Awards
- ASM International Materials Achievement Award
- Distinguished Faculty Award from Georgia Tech
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