Christopher BaileyView profile
Professor
Christopher Bailey is a Professor of Advanced Semiconductor Packaging and Director of the Centre for Advanced Semiconductor Packaging at Arizona State University (ASU). He previously served as Professor of Computational Mechanics & Reliability and Associate Dean for Research at the University of Greenwich, UK. At ASU, he leads research on advanced semiconductor packaging, including roles as Principal Investigator (PI) and Co-Investigator (Co-I) on major projects such as the SRC-funded Thermo-Mechanical Modelling and US Chips Act initiatives (e.g., SWAP-Hub, SHIELD, ITSI). His research focuses on semiconductor packaging reliability, thermal management, co-design methodologies, and multiphysics modeling. Education: MBA (Technology Management), Open University, UK PhD, Thames Polytechnic, UK Research Interests: Advanced Semiconductor Packaging Thermal Management Solutions Co-Design and Multiphysics Modeling Reliability of Electronic Components His work integrates computational mechanics, materials science, and engineering to address challenges in high-reliability electronics. Recent projects emphasize predictive modeling for semiconductor packaging failures under thermal-mechanical stress. Awards: IEEE Region 8 Europe Award (2024) IEEE David Feldman Award (2022) Visiting Professorships at IIT Kharagpur (2018/2022) and Hong Kong (2018) Service & Leadership: Former President of IEEE Electronics Packaging Society (2020–2021) Associate Editor for IEEE Transactions on Components, Packaging, and Manufacturing Technology Conference Leadership (e.g., Program Chair for IEEE PAINE 2024) He has secured over $40M in research funding and authored 400+ archival papers, with expertise spanning industry collaborations (e.g., BAe Systems, Rolls Royce) and government advisory roles (EPSRC Peer Review College, UK Research Excellence Framework).









