Shreyas Sen is the Elmore Associate Professor of Electrical and Computer Engineering at Purdue University, jointly affiliated with the School of Biomedical Engineering. He directs the Center for Internet of Bodies (C-IoB) and leads the SPARC Lab, focusing on circuits/systems for secure, energy-efficient body-centric communication and biomedical applications. Education: B.E. (Jadavpur University, 2006), M.S. & Ph.D. (Georgia Tech, 2009-2011). His research spans Human Body Communication (HBC), hardware security, IoT/IoB systems, and low-power sensing. Notable innovations include Electro-Quasistatic HBC (EQS-HBC) technology, which enables covert body-wire communication with 100x lower energy than conventional methods. Research Themes: Secure communication for medical wearables Physical layer security in IoT Ultra-low-power biosensors Side-channel attack mitigation in cryptographic ICs Publications: Over 200 papers in top venues (ISSCC, DAC, CICC, HOST) with focus on HBC systems, electromagnetic security, and biomedical circuits. Recent work explores EQS-HBC privacy properties (Nature Scientific Reports, 2019) and 350x current-domain signature attenuation for AES security (ISSCC 2020). Awards: NSF CAREER Award (2020) AFOSR Young Investigator (2016) MIT TR35 India (2018) 9 Best Paper Awards Intel Outstanding Researcher (2020) He advises over 20 students and leads industry collaborations through Ixana Inc. (founded 2020), commercializing EQS-HBC technology. Current efforts include EQS-based authentication systems and radiation dosimetry wearables.
Hamed Rahmani is an Assistant Professor of Electrical and Computer Engineering at New York University (NYU Tandon School of Engineering). He is affiliated with NYU WIRELESS and the Center for Advanced Technology in Telecommunications (CATT), leading the Research in Advanced Integrated Systems and Electronics (RAISE) Lab. His research focuses on integrated circuits and systems for biomedical applications, IoT, and 5G/6G communication. Education: Ph.D., Electrical and Computer Engineering, UCLA (2020) M.Sc., Electrical and Computer Engineering, Rice University (2017) B.Sc., Electrical Engineering, Sharif University of Technology (2014) Research Interests: RF/mm-Wave circuits, low-power biomedical sensors, energy-efficient IoT systems, and wireless power transfer. His work emphasizes miniaturized implants, smart healthcare, and sustainable electronics. Awards: Recipient of the NSF CAREER Award (2025), IEEE MTT-S Graduate Fellowship (2019), and the 2023 Best Paper Award in the Journal of Microwave. He serves on technical committees for major conferences like CICC and IMS. Labs & Groups: Directs the RAISE Lab, collaborating with NYU WIRELESS on 6G research and CATT for technology transfer.
Muhannad S. Bakir is the Dan Fielder Professor in the School of Electrical and Computer Engineering at Georgia Institute of Technology and serves as the Director of the 3D Systems Packaging Research Center. His research focuses on heterogeneous integration of microsystems, including 2.5D and 3D ICs and packaging technologies, with significant contributions to advanced cooling systems, electrical and photonic interconnects, and biosensor integration with CMOS. Dr. Bakir's research interests span heterogeneous microsystem design and integration, advanced cooling and power delivery for emerging architectures, electrical and photonic interconnect technologies, biosensor technologies, and nanofabrication. His work addresses critical challenges in next-generation electronics, enabling polylithic integration that concatenates heterogeneous ICs of various functionalities while mimicking monolithic-like densities. His research particularly focuses on co-design of thermal technologies, power delivery networks, and signaling networks for silicon nanoelectronic systems. His recent publications demonstrate strong trends in fused-silica stitch-chip technology for heterogeneous integration, with particular emphasis on RF and mm-wave applications, power delivery for AI accelerators, and thermal management solutions. His work bridges electrical engineering, materials science, and thermal management to solve critical bottlenecks in computing performance and efficiency. 2013 Intel Early Career Faculty Honor Award 2012 DARPA Young Faculty Award 2011 IEEE CPMT Society Outstanding Young Engineer Award 2012 National Academy of Engineering Frontiers of Engineering Symposium Invited Participant 2015 IEEE CPMT Society Distinguished Lecturer 2014 Best Paper of the IEEE Transactions on Components Packaging and Manufacturing Technology More than 25 conference and student paper awards Twelve issued US Patents Dr. Bakir leads the Integrated 3D Systems Lab (I3DS) at Georgia Tech, which is actively researching advanced packaging, interconnects, electrical and thermal design, and system integration. His team has received significant recognition for their work, including multiple best paper awards from major conferences like ECTC, IITC, and CICC. The lab is currently seeking postdoctoral researchers and research faculty to advance next-generation electronics through collaborative research. His lab focuses on enabling the next phase of Moore's Law through polylithic integration, which concatenates heterogeneous ICs of various functionalities (digital, analog, photonic, and mm-wave) using advanced off-chip '2.5D' and '3D' heterogeneous interconnects and packaging. This work impacts applications in high-performance computing, machine learning, edge intelligence, autonomous vehicles, augmented/virtual reality, and healthcare.
Di Zhu is a Presidential Young Professor in the Department of Materials Science and Engineering at the National University of Singapore (NUS). He holds a B.Eng. from Nanyang Technological University and M.Sc./Ph.D. from MIT, both in Electrical Engineering. His postdoctoral research at Harvard focused on lithium niobate integrated photonics and superconducting detectors. He previously worked as a research scientist and PI at A*STAR's Institute of Materials Research and Engineering (IMRE). Research Interests : Integrated quantum photonics, superconducting detectors, nonlinear optics, and nanofabrication. His group develops scalable quantum photonic devices using lithium niobate and superconducting materials, emphasizing applications in quantum computing, communication, and sensing. Awards : National Research Foundation (NRF) Fellowship Harvard Quantum Initiative (HQI) Postdoctoral Fellowship MIT Jin-Au Kong Thesis Award Advising & Recruitment : Actively recruiting postdocs, PhD students, and interns in areas like integrated photonics, quantum optics, and superconducting detectors. Positions include work on thin-film lithium niobate, quantum simulation, and microwave-optical transduction. Group website: dizhulab.org .
University of Illinois Urbana-ChampaignUnited States
Naresh R. Shanbhag is the Jack Kilby Professor in the Department of Electrical and Computer Engineering and the Coordinated Science Laboratory at the University of Illinois at Urbana-Champaign. He serves as Director of the Systems on Nanoscale Information fabriCs (SONIC) Center and held the D.J. Gandhi Distinguished Visiting Professorship at IIT Mumbai from 2015-2020. Previously, he was a visiting faculty member at National Taiwan University (2007) and Stanford University (2014). Dr. Shanbhag received his doctorate from the University of Minnesota (1993) in Electrical Engineering. From 1993 to 1995, he worked at AT&T Bell Laboratories as the lead chip architect for AT&T's 51.84 Mb/s transceiver chips over twisted-pair wiring for Asynchronous Transfer Mode (ATM)-LAN and very high-speed digital subscriber line (VDSL) chip-sets. His research focuses on the design of energy-efficient machine learning, communications, and signal processing systems on resource-constrained embedded platforms. He explores fundamental trade-offs between energy efficiency, latency and accuracy of decision-making systems implemented in nanoscale technologies, with applications to computer vision, biomedicine, automatic target recognition, and imaging. His work spans four primary focus areas: Resource-efficient Machine Learning for the Edge, In-memory Computing (IMC), Energy-efficient High Data Rate Communications, and Shannon-inspired Statistical Error Compensation (SEC). Analysis of his recent publications reveals a strong emphasis on in-memory computing architectures (SRAM, MRAM, RRAM) for machine learning acceleration. His work consistently addresses energy-accuracy trade-offs, with increasing attention to security aspects of hardware implementations and applications to MIMO signal processing and edge AI systems. His research demonstrates a progression from theoretical foundations to practical silicon implementations. 2024 Semiconductor Research Corporation Innovation Award 2018 Semiconductor Industry Association/Semiconductor Research Corporation University Researcher Award 2018 IEEE International Symposium on Circuits and Systems Best Paper Award 2006 IEEE Fellow 1996 National Science Foundation CAREER Award Professor Shanbhag has mentored over 50 graduate students who now work at leading technology companies including Qualcomm, Amazon, Nvidia, Intel, and Apple. His research has been generously supported by the National Science Foundation, DARPA, AFRL, Semiconductor Research Corporation, Texas Instruments, Sandia National Laboratories, and industry partners including IBM, GlobalFoundries, and Intel Corporation. He led the Alternative Computational Models research theme (2006-2012) and was the founding Director of the SONIC Center (2013-2017), a 5-year multi-university center funded by DARPA and SRC. Currently, he leads research themes in the SRC and DARPA funded JUMP 2.0 Program's Center for Co-Design of Cognitive Systems and the Center for Ubiquitous Connectivity, and in the NSF IUCRC Center for Advanced Semiconductor Chips with Accelerated Performance (ASAP). As Director of the Systems on Nanoscale Information fabriCs (SONIC) Center, Professor Shanbhag leads a multidisciplinary team exploring novel computing paradigms for the nanoscale era. His group has benchmarked an extensive collection of in-memory computing and digital accelerator IC designs, maintaining a publicly available IMC benchmarking repository of metrics extracted from published IC prototypes. His research philosophy integrates concepts from information theory, statistical signal processing, detection and estimation, VLSI architectures, and digital and analog integrated circuits to develop energy-efficient systems from algorithms to silicon implementations.
Jiang Hu is a Professor in the Department of Electrical and Computer Engineering at Texas A&M University, holding the Eric D. Rubin '06 Endowed Professorship. He also serves as Co-Director of Graduate Programs and is affiliated with the Computer Science & Engineering department. His research focuses on VLSI design automation, machine learning applications, and hardware security. He has held roles as editor for IEEE Transactions on CAD and ACM Transactions on Design Automation, and chaired the 2012 ACM International Symposium on Physical Design. Education: B.S. in Optical Engineering (Zhejiang University, 1990), M.S. in Physics (1997), and Ph.D. in Electrical Engineering (University of Minnesota, 2001). He worked at IBM Microelectronics before joining Texas A&M in 2002. Research interests include energy-efficient VLSI circuits, on-chip communication fabrics, analog layout automation, and AI-driven EDA. Recent work emphasizes machine learning for design closure, privacy-preserving frameworks, and systolic array-based architectures. Awards: IEEE Fellow (2016) Humboldt Research Fellowship (2012) Multiple best paper awards at DAC, ICCAD, and ASPDAC Advising and grants: Leads initiatives like the SLICE project, NSF workshops on ML-EDA infrastructure, and serves as Editor-in-Chief of ACM TODAES since 2024. His work bridges academic research and industry applications in EDA and semiconductor design. Labs/Teams: Active contributor to open-source tools like ALIGN for analog layout generation and collaborations on machine learning for EDA commons.
Gabriel Alfonso Rincon-Mora is the Motorola Solutions Foundation Professor at the Georgia Institute of Technology's School of Electrical and Computer Engineering. A Fellow of the National Academy of Inventors, IEEE, and IET, he specializes in analog/power integrated circuits, energy-harvesting systems, and microelectronics. With over 200 articles, 44 patents, and 12 books, his work has produced 26 commercial power-chip products. His research spans: Analog and power-management ICs for efficient energy conversion Self-sustaining microsystems powered by thermal, mechanical, and environmental sources Nano-scale circuit designs for biomedical and wireless sensor applications Recent publications focus on piezoelectric energy harvesting, battery charging optimization, and low-power CMOS designs, demonstrating consistent innovation in power efficiency and miniaturization. Awards include the IEEE Charles A. Desoer Technical Achievement Award, National Hispanic in Technology Award, and recognition as one of "The 100 Most Influential Hispanics." He directs research in power IC design and mentors students through the Georgia Tech Analog Consortium. His laboratory develops integrated solutions for energy-constrained applications, including collaborations with industry partners like Texas Instruments.
Dr. Chih-Hung (James) Chen is a Professor in the Department of Electrical & Computer Engineering at McMaster University. His research focuses on noise-related issues in semiconductor devices, low-noise circuit design for medical and communication applications, and thermal noise characterization in nano-scale transistors. He holds senior member status in IEEE and is a licensed Professional Engineer in Ontario. Education: Ph.D., McMaster University, 2002 M.A.Sc., Simon Fraser University, 1997 B.Sc., National Central University, Taiwan, 1991 Research interests include biomedical technologies, microelectronics & VLSI, and digital/smart systems. He has collaborated with companies like Sony Corporation, United Microelectronics Corporation, and Focus Microwaves. His work is supported by grants from the Canada Foundation for Innovation (CFI), NSERC, and the Ontario Innovation Trust (OIT). Notable achievements include serving on the International Advisory Committee of the International Conference on Noise and Fluctuations (2015) and as an editor for the Journal of Low Power Electronics and Applications since 2022. Teaching includes courses like Analysis and Design of RF ICs for Communications and Electronic Devices and Circuits 2. His research lab focuses on advancing noise measurement techniques and designing ultra-low-power analog circuits for emerging applications.
Sayfe Kiaei is a Professor in the School of Electrical, Computer and Energy Engineering at Arizona State University (ASU), where he also directs the Connection One Center, an NSF I/UCRC Center. He holds the Motorola Chair in Analog and RF Integrated Circuits. Previously, he served as a professor at Oregon State University (1987–1993) and worked at Motorola’s Wireless Technology Center (1993–2001), contributing to wireless communications and broadband systems. Education: Ph.D. in Electrical and Computer Engineering from Washington State University (1987). Research focuses on RF/analog/digital integrated circuits, transceiver design, sensors, and power management. His work is funded by agencies like DARPA, NSF, DOE, and industrial partners. Key achievements include establishing two Industry-University Cooperative Research Centers (CDADIC and Connection One) and over 200 publications. He is an IEEE Fellow and has led technical committees for major conferences (RFIC, ISCAS, MTT). Industry collaborations span companies like Intel, Samsung, Texas Instruments, and Motorola, with expertise in 3G-4G wireless, bioelectronics, Bluetooth, GPS, and MEMS sensors. Awards include IEEE Fellow status (2002–present) and leadership roles in IEEE editorial and conference committees. Grants and projects include the NSF I/UCRC for Power Management Circuits, DARPA-funded research, and international initiatives like the Pakistan Centers for Advanced Studies in Energy. His lab develops cutting-edge technologies in full-duplex radios, MEMS-based sensors, and energy-efficient IC design.
Sohmyung Ha is an Associate Professor of Electrical Engineering and Bioengineering at NYU Abu Dhabi and holds a Global Network position at NYU Tandon School of Engineering. He leads the Integrated BioElectronics Laboratory, focusing on advancing silicon integrated technologies for biomedical applications such as implantable devices and wearable sensors. His expertise spans biomedical circuits, neural interfaces, and wireless power systems. Education: MS (2004, KAIST), PhD (2016, UC San Diego) with a Best Thesis Award. Prior industry experience includes analog circuit design at Samsung Electronics (2006-2010). Academic affiliations include NYU Abu Dhabi, NYU Tandon, and global collaborations. Research interests include high-performance biomedical sensors, neural prosthetics, and energy-efficient bioelectronic systems. Notable achievements include a Best Paper Award (ISCAS 2024) and innovations in impedance spectroscopy and neural interface ICs. Current projects emphasize closed-loop neural interfaces, subcutaneous glucose monitoring, and retinal prostheses. His lab develops miniaturized, power-autonomous systems for healthcare applications.
Xilin Liu is an Assistant Professor at the Edward S. Rogers Sr. Department of Electrical & Computer Engineering (University of Toronto) and the Center for Advancing Neurotechnological Innovation to Application (CRANIA) . He obtained his PhD from the University of Pennsylvania and previously worked at Qualcomm Inc. in California. Expertise in integrated circuits and systems for brain-machine interfaces , neuromodulation , and edge AI Published in top venues including Nature Electronics , IEEE JSSC , and ISSCC Recipient of multiple best paper awards and IEEE Senior Member His research spans three main themes: High-speed data converters for wireless/wireline communication IC design for neural interfacing Accelerating machine learning via hardware Recent publications focus on closed-loop neuromodulation , ultra-wideband transceivers , and flexible biomedical sensors . These works integrate analog IC design , edge AI , and real-time neural interfacing across medical rehabilitation , parkinson's monitoring , and memory research . Awards include: IEEE Solid-State Circuits Society Predoctoral Achievement Award (2016) Best Paper Award at BioCAS (2015) ECE Department Teaching Award (2022) Multiple conference best paper finalists His lab collaborates with UHN , EMBS , and global institutions while maintaining strong commitments to equity, diversity, and inclusion (EDI) in research practices.
Swiss Federal Institute of Technology in LausanneSwitzerland
Christian Enz is a Full Professor at École Polytechnique Fédérale de Lausanne (EPFL), where he serves as Director of the Institute of Microengineering and Head of the Integrated Circuits Laboratory. With M.S. and Ph.D. degrees in electrical engineering from EPFL (1984 and 1989), he has established himself as a leading researcher in low-power analog circuit design and semiconductor device modeling. His research interests focus on very low-power analog and RF IC design , semiconductor device modeling , and increasingly on cryogenic electronics for quantum computing applications . Professor Enz is particularly known for his work on FDSOI MOSFET behavior at cryogenic temperatures, developing comprehensive models that address challenges in subthreshold swing saturation, threshold voltage shifts, and self-heating effects. As a Life Fellow of IEEE with 282 publications and over 7,400 citations, Professor Enz has made significant contributions to the field. His recent work demonstrates how the $G_{m}/I_{D}$ design methodology remains effective in advanced technology nodes and can be extended to cryogenic temperature operation. His research bridges fundamental semiconductor physics with practical circuit design considerations for quantum computing interfaces. Life Fellow, IEEE Director of the Institute of Microengineering, EPFL Head of the Integrated Circuits Laboratory 282 publications with 7,400+ citations Specialist in cryogenic CMOS for quantum computing Professor Enz's work on cryogenic electronics addresses critical challenges for quantum computing scalability. By developing accurate models for transistor behavior at temperatures as low as 3.3K, his research enables the design of specialized control electronics that can operate inside dilution refrigerators, potentially solving major wiring constraints that currently limit quantum computer scaling. His laboratory continues to advance the understanding of semiconductor device physics at cryogenic temperatures while developing practical circuit design methodologies for this emerging application domain.
Prof. Dr.-Ing. Andreas Thiede is a faculty member at the University of Paderborn , affiliated with the Faculty of Electrical Engineering, Computer Science and Mathematics and the Institute of Electrical Engineering and Information Technology . He serves as director of the High-frequency electronics (HFE) research group. Research Interests: High-frequency electronics and optoelectronics Quantum dots and exciton qubits Nonlinear photonics and ultrafast control Semiconductor device engineering Key Projects: Participates in TRR 142: Tailor-Made Nonlinear Photonics , focusing on functional structures for quantum and ultrafast systems. Teaching Roles: Analog CMOS circuits (does not apply) Analog CMOS ICs (cancelled) Contact Details: Email: andreas.thiede@uni-paderborn.de Phone: +49 5251 60-3040 Office: Pohlweg 47-49, 33098 Paderborn Space: P1.402.1
David Blaauw is the Kensall D. Wise Collegiate Professor of Electrical Engineering and Computer Science (EECS) at the University of Michigan. His research focuses on ultra-low-power analog/mixed-signal circuits, mm-scale sensors, neural networks, and biomedical applications. He leads the Blaauw Lab, which has pioneered innovations like the Michigan Micro Mote (M^3) and neural recording probes. His work emphasizes real-world deployability, with applications in environmental monitoring (e.g., monarch butterflies), medical devices, and robotics. Education: B.S. in Physics and Computer Science, Duke University (1986) Ph.D. in Computer Science, University of Illinois Urbana-Champaign (1991) Research Interests: Blaauw’s lab explores ultra-low-power computing, mm-scale systems, RF communication, in-memory computing, and genomics acceleration. Key projects include: Millimeter-scale computers (e.g., 0.04mm³ temperature sensors) Wireless neural interfaces for brain-machine communication Energy-efficient accelerators for edge AI and genomics Micro-robotics with sensing/actuation/computation Awards: IEEE Fellow 2016 SIA-SRC Faculty Award Motorola Innovation Award Best Paper Awards at ISSCC, ISCA, and RFIC Advising & Impact: Over 600 publications, 65 patents, and 4 startup companies spun from his lab. Current research includes genome sequencing accelerators (GenAx) and neural recording dust for brain mapping. He directs the Michigan Integrated Circuits Lab and chairs major conferences like ISSCC and DAC. Labs/Teams: Blaauw Lab (University of Michigan) Michigan Integrated Circuits Lab (MICAL)
Boris Murmann is Professor at Stanford University, specializing in integrated circuit design, mixed-signal computing, and energy-efficient AI hardware. His research advances neural interface technologies, analog design automation, and tinyML systems. Recent work develops ultra-low-power neural recording ICs for brain-computer interfaces, RRAM-based memory systems, and open-source semiconductor design frameworks. Publications demonstrate innovations in compressive sensing for neural data, hardware-algorithm co-design, and reinforcement learning for analog circuit synthesis. Significant contributions include Medusa (TinyML processor), EMBER (RRAM macro), and methodologies for coarsely-quantized computer vision and analog design automation.
