Shreyas Sen is the Elmore Associate Professor of Electrical and Computer Engineering at Purdue University, jointly affiliated with the School of Biomedical Engineering. He directs the Center for Internet of Bodies (C-IoB) and leads the SPARC Lab, focusing on circuits/systems for secure, energy-efficient body-centric communication and biomedical applications. Education: B.E. (Jadavpur University, 2006), M.S. & Ph.D. (Georgia Tech, 2009-2011). His research spans Human Body Communication (HBC), hardware security, IoT/IoB systems, and low-power sensing. Notable innovations include Electro-Quasistatic HBC (EQS-HBC) technology, which enables covert body-wire communication with 100x lower energy than conventional methods. Research Themes: Secure communication for medical wearables Physical layer security in IoT Ultra-low-power biosensors Side-channel attack mitigation in cryptographic ICs Publications: Over 200 papers in top venues (ISSCC, DAC, CICC, HOST) with focus on HBC systems, electromagnetic security, and biomedical circuits. Recent work explores EQS-HBC privacy properties (Nature Scientific Reports, 2019) and 350x current-domain signature attenuation for AES security (ISSCC 2020). Awards: NSF CAREER Award (2020) AFOSR Young Investigator (2016) MIT TR35 India (2018) 9 Best Paper Awards Intel Outstanding Researcher (2020) He advises over 20 students and leads industry collaborations through Ixana Inc. (founded 2020), commercializing EQS-HBC technology. Current efforts include EQS-based authentication systems and radiation dosimetry wearables.
Hamed Rahmani is an Assistant Professor of Electrical and Computer Engineering at New York University (NYU Tandon School of Engineering). He is affiliated with NYU WIRELESS and the Center for Advanced Technology in Telecommunications (CATT), leading the Research in Advanced Integrated Systems and Electronics (RAISE) Lab. His research focuses on integrated circuits and systems for biomedical applications, IoT, and 5G/6G communication. Education: Ph.D., Electrical and Computer Engineering, UCLA (2020) M.Sc., Electrical and Computer Engineering, Rice University (2017) B.Sc., Electrical Engineering, Sharif University of Technology (2014) Research Interests: RF/mm-Wave circuits, low-power biomedical sensors, energy-efficient IoT systems, and wireless power transfer. His work emphasizes miniaturized implants, smart healthcare, and sustainable electronics. Awards: Recipient of the NSF CAREER Award (2025), IEEE MTT-S Graduate Fellowship (2019), and the 2023 Best Paper Award in the Journal of Microwave. He serves on technical committees for major conferences like CICC and IMS. Labs & Groups: Directs the RAISE Lab, collaborating with NYU WIRELESS on 6G research and CATT for technology transfer.
Muhannad S. Bakir is the Dan Fielder Professor in the School of Electrical and Computer Engineering at Georgia Institute of Technology and serves as the Director of the 3D Systems Packaging Research Center. His research focuses on heterogeneous integration of microsystems, including 2.5D and 3D ICs and packaging technologies, with significant contributions to advanced cooling systems, electrical and photonic interconnects, and biosensor integration with CMOS. Dr. Bakir's research interests span heterogeneous microsystem design and integration, advanced cooling and power delivery for emerging architectures, electrical and photonic interconnect technologies, biosensor technologies, and nanofabrication. His work addresses critical challenges in next-generation electronics, enabling polylithic integration that concatenates heterogeneous ICs of various functionalities while mimicking monolithic-like densities. His research particularly focuses on co-design of thermal technologies, power delivery networks, and signaling networks for silicon nanoelectronic systems. His recent publications demonstrate strong trends in fused-silica stitch-chip technology for heterogeneous integration, with particular emphasis on RF and mm-wave applications, power delivery for AI accelerators, and thermal management solutions. His work bridges electrical engineering, materials science, and thermal management to solve critical bottlenecks in computing performance and efficiency. 2013 Intel Early Career Faculty Honor Award 2012 DARPA Young Faculty Award 2011 IEEE CPMT Society Outstanding Young Engineer Award 2012 National Academy of Engineering Frontiers of Engineering Symposium Invited Participant 2015 IEEE CPMT Society Distinguished Lecturer 2014 Best Paper of the IEEE Transactions on Components Packaging and Manufacturing Technology More than 25 conference and student paper awards Twelve issued US Patents Dr. Bakir leads the Integrated 3D Systems Lab (I3DS) at Georgia Tech, which is actively researching advanced packaging, interconnects, electrical and thermal design, and system integration. His team has received significant recognition for their work, including multiple best paper awards from major conferences like ECTC, IITC, and CICC. The lab is currently seeking postdoctoral researchers and research faculty to advance next-generation electronics through collaborative research. His lab focuses on enabling the next phase of Moore's Law through polylithic integration, which concatenates heterogeneous ICs of various functionalities (digital, analog, photonic, and mm-wave) using advanced off-chip '2.5D' and '3D' heterogeneous interconnects and packaging. This work impacts applications in high-performance computing, machine learning, edge intelligence, autonomous vehicles, augmented/virtual reality, and healthcare.
University of Illinois Urbana-ChampaignUnited States
Naresh R. Shanbhag is the Jack Kilby Professor in the Department of Electrical and Computer Engineering and the Coordinated Science Laboratory at the University of Illinois at Urbana-Champaign. He serves as Director of the Systems on Nanoscale Information fabriCs (SONIC) Center and held the D.J. Gandhi Distinguished Visiting Professorship at IIT Mumbai from 2015-2020. Previously, he was a visiting faculty member at National Taiwan University (2007) and Stanford University (2014). Dr. Shanbhag received his doctorate from the University of Minnesota (1993) in Electrical Engineering. From 1993 to 1995, he worked at AT&T Bell Laboratories as the lead chip architect for AT&T's 51.84 Mb/s transceiver chips over twisted-pair wiring for Asynchronous Transfer Mode (ATM)-LAN and very high-speed digital subscriber line (VDSL) chip-sets. His research focuses on the design of energy-efficient machine learning, communications, and signal processing systems on resource-constrained embedded platforms. He explores fundamental trade-offs between energy efficiency, latency and accuracy of decision-making systems implemented in nanoscale technologies, with applications to computer vision, biomedicine, automatic target recognition, and imaging. His work spans four primary focus areas: Resource-efficient Machine Learning for the Edge, In-memory Computing (IMC), Energy-efficient High Data Rate Communications, and Shannon-inspired Statistical Error Compensation (SEC). Analysis of his recent publications reveals a strong emphasis on in-memory computing architectures (SRAM, MRAM, RRAM) for machine learning acceleration. His work consistently addresses energy-accuracy trade-offs, with increasing attention to security aspects of hardware implementations and applications to MIMO signal processing and edge AI systems. His research demonstrates a progression from theoretical foundations to practical silicon implementations. 2024 Semiconductor Research Corporation Innovation Award 2018 Semiconductor Industry Association/Semiconductor Research Corporation University Researcher Award 2018 IEEE International Symposium on Circuits and Systems Best Paper Award 2006 IEEE Fellow 1996 National Science Foundation CAREER Award Professor Shanbhag has mentored over 50 graduate students who now work at leading technology companies including Qualcomm, Amazon, Nvidia, Intel, and Apple. His research has been generously supported by the National Science Foundation, DARPA, AFRL, Semiconductor Research Corporation, Texas Instruments, Sandia National Laboratories, and industry partners including IBM, GlobalFoundries, and Intel Corporation. He led the Alternative Computational Models research theme (2006-2012) and was the founding Director of the SONIC Center (2013-2017), a 5-year multi-university center funded by DARPA and SRC. Currently, he leads research themes in the SRC and DARPA funded JUMP 2.0 Program's Center for Co-Design of Cognitive Systems and the Center for Ubiquitous Connectivity, and in the NSF IUCRC Center for Advanced Semiconductor Chips with Accelerated Performance (ASAP). As Director of the Systems on Nanoscale Information fabriCs (SONIC) Center, Professor Shanbhag leads a multidisciplinary team exploring novel computing paradigms for the nanoscale era. His group has benchmarked an extensive collection of in-memory computing and digital accelerator IC designs, maintaining a publicly available IMC benchmarking repository of metrics extracted from published IC prototypes. His research philosophy integrates concepts from information theory, statistical signal processing, detection and estimation, VLSI architectures, and digital and analog integrated circuits to develop energy-efficient systems from algorithms to silicon implementations.
Jiang Hu is a Professor in the Department of Electrical and Computer Engineering at Texas A&M University, holding the Eric D. Rubin '06 Endowed Professorship. He also serves as Co-Director of Graduate Programs and is affiliated with the Computer Science & Engineering department. His research focuses on VLSI design automation, machine learning applications, and hardware security. He has held roles as editor for IEEE Transactions on CAD and ACM Transactions on Design Automation, and chaired the 2012 ACM International Symposium on Physical Design. Education: B.S. in Optical Engineering (Zhejiang University, 1990), M.S. in Physics (1997), and Ph.D. in Electrical Engineering (University of Minnesota, 2001). He worked at IBM Microelectronics before joining Texas A&M in 2002. Research interests include energy-efficient VLSI circuits, on-chip communication fabrics, analog layout automation, and AI-driven EDA. Recent work emphasizes machine learning for design closure, privacy-preserving frameworks, and systolic array-based architectures. Awards: IEEE Fellow (2016) Humboldt Research Fellowship (2012) Multiple best paper awards at DAC, ICCAD, and ASPDAC Advising and grants: Leads initiatives like the SLICE project, NSF workshops on ML-EDA infrastructure, and serves as Editor-in-Chief of ACM TODAES since 2024. His work bridges academic research and industry applications in EDA and semiconductor design. Labs/Teams: Active contributor to open-source tools like ALIGN for analog layout generation and collaborations on machine learning for EDA commons.
Gabriel Alfonso Rincon-Mora is the Motorola Solutions Foundation Professor at the Georgia Institute of Technology's School of Electrical and Computer Engineering. A Fellow of the National Academy of Inventors, IEEE, and IET, he specializes in analog/power integrated circuits, energy-harvesting systems, and microelectronics. With over 200 articles, 44 patents, and 12 books, his work has produced 26 commercial power-chip products. His research spans: Analog and power-management ICs for efficient energy conversion Self-sustaining microsystems powered by thermal, mechanical, and environmental sources Nano-scale circuit designs for biomedical and wireless sensor applications Recent publications focus on piezoelectric energy harvesting, battery charging optimization, and low-power CMOS designs, demonstrating consistent innovation in power efficiency and miniaturization. Awards include the IEEE Charles A. Desoer Technical Achievement Award, National Hispanic in Technology Award, and recognition as one of "The 100 Most Influential Hispanics." He directs research in power IC design and mentors students through the Georgia Tech Analog Consortium. His laboratory develops integrated solutions for energy-constrained applications, including collaborations with industry partners like Texas Instruments.
Sayfe Kiaei is a Professor in the School of Electrical, Computer and Energy Engineering at Arizona State University (ASU), where he also directs the Connection One Center, an NSF I/UCRC Center. He holds the Motorola Chair in Analog and RF Integrated Circuits. Previously, he served as a professor at Oregon State University (1987–1993) and worked at Motorola’s Wireless Technology Center (1993–2001), contributing to wireless communications and broadband systems. Education: Ph.D. in Electrical and Computer Engineering from Washington State University (1987). Research focuses on RF/analog/digital integrated circuits, transceiver design, sensors, and power management. His work is funded by agencies like DARPA, NSF, DOE, and industrial partners. Key achievements include establishing two Industry-University Cooperative Research Centers (CDADIC and Connection One) and over 200 publications. He is an IEEE Fellow and has led technical committees for major conferences (RFIC, ISCAS, MTT). Industry collaborations span companies like Intel, Samsung, Texas Instruments, and Motorola, with expertise in 3G-4G wireless, bioelectronics, Bluetooth, GPS, and MEMS sensors. Awards include IEEE Fellow status (2002–present) and leadership roles in IEEE editorial and conference committees. Grants and projects include the NSF I/UCRC for Power Management Circuits, DARPA-funded research, and international initiatives like the Pakistan Centers for Advanced Studies in Energy. His lab develops cutting-edge technologies in full-duplex radios, MEMS-based sensors, and energy-efficient IC design.
Sohmyung Ha is an Associate Professor of Electrical Engineering and Bioengineering at NYU Abu Dhabi and holds a Global Network position at NYU Tandon School of Engineering. He leads the Integrated BioElectronics Laboratory, focusing on advancing silicon integrated technologies for biomedical applications such as implantable devices and wearable sensors. His expertise spans biomedical circuits, neural interfaces, and wireless power systems. Education: MS (2004, KAIST), PhD (2016, UC San Diego) with a Best Thesis Award. Prior industry experience includes analog circuit design at Samsung Electronics (2006-2010). Academic affiliations include NYU Abu Dhabi, NYU Tandon, and global collaborations. Research interests include high-performance biomedical sensors, neural prosthetics, and energy-efficient bioelectronic systems. Notable achievements include a Best Paper Award (ISCAS 2024) and innovations in impedance spectroscopy and neural interface ICs. Current projects emphasize closed-loop neural interfaces, subcutaneous glucose monitoring, and retinal prostheses. His lab develops miniaturized, power-autonomous systems for healthcare applications.
David Blaauw is the Kensall D. Wise Collegiate Professor of Electrical Engineering and Computer Science (EECS) at the University of Michigan. His research focuses on ultra-low-power analog/mixed-signal circuits, mm-scale sensors, neural networks, and biomedical applications. He leads the Blaauw Lab, which has pioneered innovations like the Michigan Micro Mote (M^3) and neural recording probes. His work emphasizes real-world deployability, with applications in environmental monitoring (e.g., monarch butterflies), medical devices, and robotics. Education: B.S. in Physics and Computer Science, Duke University (1986) Ph.D. in Computer Science, University of Illinois Urbana-Champaign (1991) Research Interests: Blaauw’s lab explores ultra-low-power computing, mm-scale systems, RF communication, in-memory computing, and genomics acceleration. Key projects include: Millimeter-scale computers (e.g., 0.04mm³ temperature sensors) Wireless neural interfaces for brain-machine communication Energy-efficient accelerators for edge AI and genomics Micro-robotics with sensing/actuation/computation Awards: IEEE Fellow 2016 SIA-SRC Faculty Award Motorola Innovation Award Best Paper Awards at ISSCC, ISCA, and RFIC Advising & Impact: Over 600 publications, 65 patents, and 4 startup companies spun from his lab. Current research includes genome sequencing accelerators (GenAx) and neural recording dust for brain mapping. He directs the Michigan Integrated Circuits Lab and chairs major conferences like ISSCC and DAC. Labs/Teams: Blaauw Lab (University of Michigan) Michigan Integrated Circuits Lab (MICAL)
Alyssa B. Apsel is a Professor of Electrical and Computer Engineering at Cornell University since 2002 and a Visiting Professor at Imperial College London. She became the IBM Professor of Engineering in 2023 and Director of Electrical and Computer Engineering at Cornell in 2018. Education: B.S., Electrical Engineering, Swarthmore College (1995) M.S., Electrical Engineering, California Institute of Technology (1996) Ph.D., Electrical Engineering, Johns Hopkins University (2002) Research Focus: She specializes in power-aware mixed-signal circuits for scaled CMOS and modern systems. Her group explores cost-effective designs addressing device scaling challenges (variation, noise, reduced analog performance) through analog/mixed-signal innovation, particularly in IoT radios and reconfigurable multi-standard wireless systems. Key areas: RF circuits, VLSI integration, biomedical telemetry, and low-power design. Publication Trends: Her 2016 work spans RF transceiver design, thermometer DAC calibration, biomedical ICs with UWB telemetry, and jitter-measurement circuits. These reflect her expertise in low-power wireless systems, analog/mixed-signal design, and biomedical electronics. Awards: IEEE Fellow (2020) IEEE CAS Distinguished Lecturer (2018-2019) ISLPED Design Contest Second Place (2010) Multiple Student Paper Awards (2000, 1995) Fellowships: Abel Wolman (1997), Caltech Institute (1995) Grants & Leadership: She founded EchoICs, which received a $275,000 NSF STTR Phase I Award (2024) for flexible spectrum radios. Her lab focuses on RF interfaces for implantable electronics and photonic integration.
Christopher E. Carr is an Assistant Professor at the Daniel Guggenheim School of Aerospace Engineering in the College of Engineering at Georgia Institute of Technology, with a secondary appointment in the School of Earth and Atmospheric Sciences in the College of Sciences. He runs the Planetary eXploration Lab (PXL) and is a member of the Space Systems Design Lab (SSDL). His work focuses on searching for and expanding the presence of life beyond Earth while enabling a sustainable human future in space environments. Dr. Carr's research interests include: Astrobiology and space biology Development of life detection instruments Microbial habitability in extreme environments Molecular evolution and biosignature detection Miniaturization and integration of scientific instrumentation Interplanetary mission design Micro and nano device engineering for space applications His recent publications demonstrate a strong focus on life detection technologies, planetary exploration, and space biology. The articles span topics from developing biosignature detection methods to analyzing microbial survival in extreme environments, with particular attention to Mars, Venus, and Europa exploration. Scientific awards and recognitions include: Scott M. Johnson Fellow in the U.S. Japan Leadership Program Dr. Carr's laboratory affiliations include: Planetary eXploration Lab (PXL) Space Systems Design Lab (SSDL) He is affiliated with the Center for Space Technology and Research at Georgia Tech.
Professor John D. Cressler is a tenured faculty member at the Georgia Institute of Technology, holding a position within the School of Electrical and Computer Engineering in the College of Engineering. His research focuses on cutting-edge semiconductor technologies, particularly silicon-germanium heterojunction bipolar transistors (SiGe HBTs) for mixed-signal applications spanning RF, microwave, mm-wave, analog, and digital domains. His research interests center on atomic-scale bandgap engineering for next-generation semiconductor devices, with emphasis on SiGe HBT technology development, radiation-hardened circuits for space applications, cryogenic electronics, and device-circuit interactions. His team explores fundamental device theory, broadband noise analysis, profile optimization, 2-D/3-D simulation, compact modeling, and radiation effects. Current projects include Europa-surface mission electronics, D-band/sub-THz systems, and radiation-tolerant receiver designs. Analysis of his 15 most recent publications (2024-2025) reveals a dominant focus on radiation-hardened electronics for space applications (40% of works), millimeter-wave circuit design (30%), and SiGe HBT reliability optimization (30%). Key trends include Europa mission electronics development, D-band/sub-THz circuit innovation, and advanced radiation mitigation techniques using SiGe BiCMOS technology. Professor Cressler teaches multiple courses including ECE 3040 (Microelectronic Circuits), ECE 3450 (Semiconductor Devices), ECE 6444 (Silicon-Based Heterostructure Devices and Circuits), and the interdisciplinary IAC 2002 course on Science, Engineering and Religion. His research is supported by industrial collaborations and Georgia Tech facilities including the Georgia Electronic Design Center (GEDC), NanoTECH, and C-STAR.
Bertan Bakkaloglu is the On Semiconductor Professor in the School of Electrical, Computer and Energy Engineering at Arizona State University (ASU), where he has been since 2004. Prior to ASU, he worked at Texas Instruments focusing on analog, mixed-signal, and RF SoC development for communication transceivers. His research expertise spans RF and mixed-signal IC design, wireless/wireline communication systems, and broadband communication systems. Education: Ph.D. in Electrical Engineering, Oregon State University (1995) M.S.C. in Electrical Engineering, University of Houston (1992) Research Interests: RF and mixed-signal integrated circuits Power management ICs (including LDO regulators and DC-DC converters) High-efficiency power delivery systems Radiation-hardened electronics for space applications MEMS-based sensor systems Biomedical circuits for implantable devices Grants & Collaborations: Over 40+ funded research projects with institutions like NASA/JPL, BAE Systems, and NSF, focusing on power electronics, space systems, and biomedical applications Key projects include radiation-hardened converters, self-calibrating DACs, and implantable medical device circuits Industry partnerships with Texas Instruments, Space Micro, and FLIR Professional Activities: Technical committee member for IEEE Radio Frequency Integrated Circuits Conference Founding chair of IEEE Solid-State Circuits Society Phoenix Chapter
Donald Lie is a Professor and the Keh-Shew Lu Regents Chair in Electrical and Computer Engineering at Texas Tech University's Whitacre College of Engineering. His research focuses on low-power RF/analog integrated circuits, System-on-a-Chip (SoC) design, and interdisciplinary applications in medical electronics, biosensors, and biosignal processing. PhD, Electrical Engineering, California Institute of Technology (1995) MS, Electrical Engineering, California Institute of Technology (1990) BS, Electrical Engineering, National Taiwan University (1987) Donald Lie's research bridges RF/analog circuit design with biomedical engineering, emphasizing millimeter-wave power amplifiers for 5G systems and non-contact vital signs monitoring using software-defined radio (SDR). His work explores CMOS FD-SOI, GaN HEMTs, and SiGe technologies for high-efficiency, linear RF front-end modules and wearable biosensors. His 15 most recent publications focus on 5G communication systems , millimeter-wave power amplifier design in CMOS FD-SOI and GaN , digital predistortion techniques, and non-contact biosensors . These works highlight advancements in wideband amplifiers for 5G FR2 bands and wireless power transfer for medical devices. Institute of Electrical and Electronics Engineers (2017) Excellent Paper Award Winner (2019) Best Student Poster Paper Award Winner (2019) Donald Lie has secured NSF Student Travel Grants for conferences like RFIC 2022 and 2020. He leads the RF/Analog System-on-a-Chip (SoC) Design Lab , which develops innovative solutions for 5G RF front-ends and biomedical sensing systems.
Ningyuan Cao is an Assistant Professor in the Department of Electrical Engineering at the University of Notre Dame, College of Engineering. He leads the Circuit and System Intelligence Research Lab , focusing on the intersection of advanced hardware design and real-time/low-power machine learning applications. Education : Ph.D., Electrical and Electronics Engineering, Georgia Institute of Technology (2020) M.S., Electrical Engineering, Columbia University (2015) B.S., Electrical and Electronics Engineering, Shanghai Jiao Tong University (2013) His research investigates custom analog/mixed-signal circuits , digital architecture , and micro-system design for machine learning acceleration, distributed intelligence, and data-driven IC design automation. Key application domains include Internet-of-Everything, tactile internet, and mixed reality systems. Recent publications highlight work on Bayesian neural networks , privacy-preserving bio-signal encoders , transformer-based surrogate models , and compute-in-memory architectures . Technical themes span neuromorphic computing, uncertainty quantification, and hardware security.
