Xuejun Fan

Dr. Xuejun Fan is a Regents' Professor and Mary Ann and Lawrence E. Faust Endowed Professor in the Department of Mechanical Engineering at Lamar University. His career spans academia and industry, with expertise in microelectronics packaging reliability, material characterization, and thermal management. He earned his Ph.D. in Solid Mechanics from Tsinghua University (1989) and held roles at Taiyuan University of Technology, University of Tokyo, and Intel Corporation before joining Lamar University in 2007, where he was promoted to full professor in 2013.

• Education: Ph.D. (Solid Mechanics, Tsinghua University), M.S. & B.S. (Applied Mechanics, Tianjin University)

Dr. Fan's research focuses on multi-physics modeling of electronic packaging, moisture-induced reliability in IC devices, electromigration analysis in interconnects, and thermal management for LEDs and power electronics. His work includes nanoscale material characterization and warpage-free packaging design. Publications highlight applications in heterogeneous integration and corrosion-resistant nanomaterials.

His 15 most recent articles emphasize chiplet packaging, electromigration modeling, and AI-driven reliability optimization. Key trends include thermal-mechanical stress analysis in SiC modules and moisture diffusion in nanocopper pastes.

• Scientific Awards: IEEE Fellow, EuroSimE Achievement Award, Top 2% Scientist (2024), Distinguished Faculty Research Fellow

Dr. Fan mentors graduate students in finite element analysis, electromigration, and material testing using equipment like DMA/TMA/TGA analyzers and Labsphere Illumia Pro. He serves as Associate Editor for IEEE Transactions and Microelectronics Reliability, and contributes to industry standards via IEEE EPS.