Robert Fischbach

Dr. Robert Fischbach is a researcher at the Institute of Micro and Electronic Systems (FET) at Dresden University of Technology. His work focuses on 3D integration, heterogeneous system design, layout verification, and thermal analysis of advanced electronic packaging solutions.

• Key research areas:
  • 3D Integrated Circuits
  • Thermal and Reliability Engineering
  • Design Automation & Optimization
  • Interposer-Based Systems

He has contributed extensively to co-design methodologies, micro-transfer printing assembly, and XML/XSLT-based simulation frameworks. Collaborative work includes automotive mission profiles and standardized formats for electronics reliability.

Notable publications span topics in layout verification, thermal modeling, and heterogeneous packaging. His collaborations include researchers like J. Lienig, A. Krinke, and T. Horst.