Microelectronics Cooling Professors and Supervisors | ApplySharif

جست‌وجوی استاد و پژوهشگر

استاد راهنما، استاد دانشگاه یا پژوهشگر مناسب برای مسیر پژوهشی‌تان را پیدا کنید و با او ارتباط بگیرید.

نمایش ۱-۱۵ از ۹۵ استاد راهنما

اطلاعات این پروفایل‌ها از صفحات عمومی دانشگاه‌ها جمع‌آوری شده و ممکن است به‌روز نباشد.

Subhasish Mitraمشاهده پروفایل

استاد

Stanford UniversityUnited States

Subhasish Mitra is the William E. Ayer Professor of Electrical Engineering and Computer Science at Stanford University, holding dual appointments in both departments. He leads the Stanford Robust Systems Group and serves on the leadership team of the Microelectronics Commons AI Hardware Hub under the US CHIPS and Science Act. His research spans Robust Computing, NanoSystems, Electronic Design Automation (EDA), and Neurosciences, with breakthroughs in X-Compact test compression, carbon nanotube computing, and 3D integration. He has held international roles like the Carnot Chair at CEA-LETI and Visiting Professorships globally. Education & Honors: Recipient of over 40 awards including the IEEE Computer Society’s Harry H. Goode Memorial Award, ACM/IEEE’s A. Richard Newton Technical Impact Award, and the Intel Achievement Award. He earned top academic accolades from IIT Kharagpur and Jadavpur University, and is a Fellow of ACM and IEEE. Research Impact: Pioneered first-of-their-kind systems like the carbon nanotube computer and monolithic 3D integration. His work on robust computing techniques like QED validation and X-Compact compression has industry-wide adoption, saving billions in manufacturing costs. Collaborates with industry leaders like Intel, Google, and Samsung. Publications & Grants: Over 400 publications, including award-winning papers in DAC, ISSCC, and IEEE journals. Leads grants from NSF, DoE, and industry partnerships. His lab explores cutting-edge topics like neuromorphic computing, 3D thermal scaffolding, and AI hardware acceleration. Administration & Outreach: Serves as Associate Chair (Faculty Affairs) for Stanford’s Computer Science Department. Recognized by students for mentorship, and frequently invited to global forums like the World Economic Forum and National Academy of Engineering.

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Michael McAlpineمشاهده پروفایل

استاد

University of Minnesota Twin CitiesUnited States

Michael McAlpine is a Professor in the Mechanical Engineering department at the University of Minnesota . He also holds affiliations with the Biomedical Engineering and Electrical and Computer Engineering departments. His research focuses on 3D printing functional materials & devices , Nanoscale inks , Biomedical devices , Bioelectronics , and Flexible Microsystems . Research Interests : 3D Printing, Biomedical Engineering, Nanotechnology, Flexible Electronics, Microfluidics Labs : ME 361/363 Contact : mcalpine@umn.edu , (612) 626-3303, ME 117 Recent Research Trends include 3D Printed Biomedical Devices , Flexible Electronics , and Bioprinting Applications . His work spans from Spinal Organoid Formation to Programmable Drug Release Capsules . Scientific Award : Circulation Research 2020 Best Manuscript Award

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Peter Teertstraمشاهده پروفایل

دانشیار

University of WaterlooCanada

Peter Teertstra is an Associate Professor, Teaching Stream in the Department of Mechanical and Mechatronics Engineering at the University of Waterloo and Director of the Sedra Student Design Centre. He holds a PhD (2003), MASc (1992), and BSE (1990) from the University of Waterloo and Calvin College, respectively. His research focuses on thermal modeling for microelectronics/optoelectronics cooling, experimental heat transfer in micro/nano-scale systems, and predicting air cooling limits in electronics. He oversees the Sedra Student Design Centre, supporting teams in competitions through resource access and sponsorship. Teertstra teaches courses like GENE 199, ME 101, MTE 201, and PD 21, emphasizing engineering practice and thermodynamics. His publications (2006–2011) address thermal conductivity in fuel cells, convection modeling, and heat transfer in electronics enclosures. He is currently accepting graduate applications via an online process.

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Laurent Mydlarskiمشاهده پروفایل

استاد

McGill UniversityCanada

Laurent Mydlarski is a Professor in the Department of Mechanical Engineering at McGill University, affiliated with the Faculty of Engineering. His research focuses on experimental fluid mechanics, particularly turbulent flows and scalar mixing. He holds a Ph.D. from Cornell University and B.A.Sc. from the University of Waterloo. Research interests include turbulence statistics, scalar dispersion, differential diffusion, and industrial cooling applications such as hydroelectric generators and microelectronics. His work combines experimental methods like hot-wire anemometry, laser-induced fluorescence, and particle-tracking velocimetry. Key contributions include studies on multi-scalar mixing in jets, wall shear stress in turbulent flows, and thermal anemometry probe design. His Mydlarski Lab at McGill explores both fundamental fluid dynamics and practical engineering solutions. Recent publications (2023-2025) address multi-scalar mixing metrics, electronic cooling innovations, and drag reduction on porous cylinders. Collaborations with industry focus on applying fluid mechanics principles to real-world thermal management challenges.

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Elison Matioliمشاهده پروفایل

استاد

Swiss Federal Institute of Technology in LausanneSwitzerland

Elison Matioli is a Professor at the Institute of Electrical Engineering (STI) at EPFL and director of the POWERlab. He holds a B.Sc. in Applied Physics and Applied Mathematics from Ecole Polytechnique (France), a B.Sc. in Electrical Engineering from the University of São Paulo (Brazil), and a Ph.D. in Materials Science from the University of California, Santa Barbara. His postdoctoral research at MIT focused on electrical engineering and computer science. His research centers on advanced semiconductor devices, particularly GaN-based power electronics, microfluidic cooling systems, and nanotechnology innovations for high-power applications. Key areas include developing high-efficiency GaN transistors, optimizing power conversion systems, and exploring terahertz generation through nanoplasma switches. His work emphasizes integrating novel materials (e.g., diamond, LiNiO) and cooling solutions to enhance device performance and reliability. Publications highlight breakthroughs in GaN power devices, microfluidic integration for thermal management, and ultrafast switching technologies. His contributions span device physics, fabrication techniques, and energy-efficient systems, with applications in next-generation power electronics and renewable energy infrastructure.

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Joshua Gessمشاهده پروفایل

دانشیار

Oregon State UniversityUnited States

Joshua Gess is an Associate Professor in the Mechanical, Industrial, and Manufacturing Engineering department at Oregon State University's College of Engineering. He joined Oregon State in 2015 and serves as a co-principal investigator at the Enhanced Heat Transfer Laboratory, where he leads research in thermal management solutions for high-performance microelectronics. His educational background includes: PhD, Mechanical Engineering, Auburn University, 2015 MS, Mechanical Engineering, Auburn University, 2012 B.E., Mechanical Engineering, Vanderbilt University, 2005 Before academia, he worked as a mechanical engineer at SSOE Group (including consulting for Johns Manville) and Northrop Grumman where he focused on military communication equipment. Professor Gess specializes in advancing thermal management solutions for high-performance microelectronic equipment. His research spans multiple scales, examining single and two-phase heat transfer on the macro-scale with passive and active liquid immersion techniques, as well as on the micro and nano scale for complex embedded thermal management solutions. He combines fundamental heat transfer knowledge with novel experimental methods such as two-phase PIV and high-speed image capture to develop reliable and energy-efficient cooling solutions for demanding electronics systems. His publication record demonstrates a clear trajectory toward increasingly sophisticated thermal management solutions, with recent work focusing on additive manufacturing applications for cooling systems, semiconductor thermal management, and nuclear reactor cooling systems. His research has significant implications for data center energy efficiency, where even small improvements in cooling efficiency could save enormous amounts of energy that could be returned to the grid. Gess is deeply committed to mentoring graduate students, emphasizing the practical applications of engineering principles. He attributes his interest in engineering to childhood influences like the movie RoboCop and the TV series MacGyver, and finds the reality of engineering work just as gratifying as he'd imagined. He particularly values the moments when his graduate students "get it" and watching them grow with each new accomplishment. As a person with a disability himself, Gess is passionate about establishing more robust support systems for people with disabilities at Oregon State. He is working with the School of Public Health to start an adaptive sports program, with the goal of building infrastructure that allows anyone to feel welcome and pursue advanced degrees at the university.

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Longji Cuiمشاهده پروفایل

استادیار

University of ColoradoUnited States

Dr. Longji Cui is an Assistant Professor in the Thermo Fluid Sciences, Materials, and Micro/Nanoscale disciplines at the University of Colorado Boulder, affiliated with the Department of Mechanical Engineering within the College of Engineering and Applied Science. His laboratory focuses on high-precision instrumentation and computational techniques to explore energy transport, conversion, and dissipation at extreme scales, including scanning thermal microscopy, picowatt-resolution sensors, and nanophotonics. Lab Location: ECME 1B66F / ECME 108 Office Location: ECME 267B Research Interests: Dr. Cui's work spans thermal energy sciences, ultrahigh-resolution sensing, scanning probe microscopy, nano-optics, and quantum engineering. His interdisciplinary projects address critical challenges in sustainable energy systems, next-generation microelectronics, and advanced sensor technologies for high-performance applications. Notable contributions include innovations in thermophotovoltaic systems, molecular-scale thermal transport, and plasmonic light emission mechanisms. Recent publications emphasize near-field thermal radiation, quantized thermal transport in single-atom junctions, and enhanced energy conversion through nanoscale engineering. These studies bridge fundamental physics with practical applications in renewable energy and nanotechnology. Awards: 2025 CEAS Innovation & Entrepreneurship Fellow 2024 ASME Rising Star Award 2023 NSF CAREER Award 2023 CU Boulder Lab Venture Challenge Award His research group collaborates across disciplines to advance instrumentation for atomic-scale thermal measurements and develop novel materials for energy applications. Ongoing efforts include optimizing thermophotovoltaic devices and exploring hot-carrier dynamics in plasmonic systems.

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Muhannad S. Bakirمشاهده پروفایل

استاد

Georgia Institute of TechnologyUnited States

Muhannad S. Bakir is the Dan Fielder Professor in the School of Electrical and Computer Engineering at Georgia Institute of Technology, and Director of the 3D Systems Packaging Research Center . His research focuses on heterogeneous integration , electrical/photonic interconnects , thermal modeling , and electronics for healthcare , with over 180 publications and 12 U.S. patents. Research areas include: Advanced cooling and power delivery for emerging systems Biosensor-CMOS integration 2.5D/3D IC packaging Polylithic integration technology Nanofabrication for microsystems Scientific accolades include: 2018 IEEE EPS Exceptional Technical Achievement Award 2013 Intel Early Career Faculty Honor Award 2012 DARPA Young Faculty Award 2011 IEEE CPMT Outstanding Young Engineer Award Best paper awards at IEEE ECTC, IITC, and CICC 2020 Georgia Tech Doctoral Thesis Advisor Award His lab explores integrated 3D systems with emphasis on co-design of thermal, power, and electrical networks for machine learning and healthcare applications.

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Shiv Govind Singhمشاهده پروفایل

استاد

Indian Institute of Technology Hyderabad (IITH)India

Dr. Shiv Govind Singh is a Professor in the Department of Electrical Engineering at the Indian Institute of Technology Hyderabad (IITH). His research spans interdisciplinary areas at the intersection of Micro/Nanotechnology , Biomedical Devices , and Wireless Communications , with a focus on advanced electronics and sensing systems. Education: PhD (IIT Bombay, 2008), MTech (IIT Kanpur, 1999) Research Interests: Dr. Singh’s work emphasizes cutting-edge technologies such as 3D-ICs , Nano-Biosensors , RF MEMS , and Lab-on-Chip systems , alongside applications in Biomedical diagnostics , Energy Harvesting , and Semiconductor Device Modeling . Advising: He has supervised or is currently supervising 25+ PhD students across diverse topics in Microelectronics , Nanotechnology , and Healthcare Devices , including both current and graduated scholars.

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Kevin Pipeمشاهده پروفایل

استاد

University of Michigan-Ann ArborUnited States

Kevin Pipe is a Professor of Mechanical Engineering, Applied Physics, and Electrical Engineering at the University of Michigan’s College of Engineering, where he also serves as Associate Dean for Undergraduate Education. He holds a Ph.D. (2004) and dual bachelor's/master's degrees (1999) in Electrical Engineering from MIT. His research focuses on microscale heat transfer in electronic/optoelectronic devices, thermoelectric energy conversion, and medical thermal applications. Key projects include molecularly engineered high-conductivity polymers, phase-change materials for thermal management, and cryoanesthesia devices. His work has been featured in Wired and Phys.org , and he received the DARPA Young Faculty Award (2009) and ME Achievement Award (2008). Research collaborations include work with MSE Professor Jinsang Kim’s group on polymer thermal conductivity and computational sprinting projects with computer science partners. His lab explores thermal interfaces in high-power diode lasers, spinal cool-sensing circuits, and ultra-rapid cooling anesthesia systems. Over 60 peer-reviewed articles and patents document his contributions to thermal sciences and materials engineering. Current efforts emphasize translating lab innovations into clinical and industrial applications. Education: Ph.D. in EE, MIT (2004) M.Eng. in EECS, MIT (1999) S.B. in EECS, MIT (1999) Key Awards: Defense Advanced Research Projects Agency Young Faculty Award (2009) ME Achievement Award (2008) Lab Focus Areas: Thermal management of microelectronics Thermoelectric materials Medical thermal devices Grant activities include DARPA-funded projects and industry partnerships. His interdisciplinary approach bridges mechanical, electrical, and biomedical engineering to address thermal challenges in computing and healthcare.

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Mehdi Asheghiمشاهده پروفایل

استاد مدعو

Stanford UniversityUnited States

Mehdi Asheghi is an Adjunct Professor at Stanford University specializing in advanced thermal management solutions. His research focuses on heat transfer optimization, electronics cooling, and energy-efficient systems using cutting-edge materials science and micro/nanofabrication techniques. His work spans high-heat-flux cooling, phase-change materials, and thermal interface technologies, with applications in power electronics, integrated circuits, and sustainable energy systems. Innovations include microchannel coolers, copper nanowire composites, and porous thermal structures. With publications addressing thermal challenges from chip-scale to industrial systems, his research advances reliability and performance in electronic devices and energy infrastructure.

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Christopher Baileyمشاهده پروفایل

استاد

Arizona State UniversityUnited States

Christopher Bailey is a Professor of Advanced Semiconductor Packaging and Director of the Centre for Advanced Semiconductor Packaging at Arizona State University (ASU). He previously served as Professor of Computational Mechanics & Reliability and Associate Dean for Research at the University of Greenwich, UK. At ASU, he leads research on advanced semiconductor packaging, including roles as Principal Investigator (PI) and Co-Investigator (Co-I) on major projects such as the SRC-funded Thermo-Mechanical Modelling and US Chips Act initiatives (e.g., SWAP-Hub, SHIELD, ITSI). His research focuses on semiconductor packaging reliability, thermal management, co-design methodologies, and multiphysics modeling. Education: MBA (Technology Management), Open University, UK PhD, Thames Polytechnic, UK Research Interests: Advanced Semiconductor Packaging Thermal Management Solutions Co-Design and Multiphysics Modeling Reliability of Electronic Components His work integrates computational mechanics, materials science, and engineering to address challenges in high-reliability electronics. Recent projects emphasize predictive modeling for semiconductor packaging failures under thermal-mechanical stress. Awards: IEEE Region 8 Europe Award (2024) IEEE David Feldman Award (2022) Visiting Professorships at IIT Kharagpur (2018/2022) and Hong Kong (2018) Service & Leadership: Former President of IEEE Electronics Packaging Society (2020–2021) Associate Editor for IEEE Transactions on Components, Packaging, and Manufacturing Technology Conference Leadership (e.g., Program Chair for IEEE PAINE 2024) He has secured over $40M in research funding and authored 400+ archival papers, with expertise spanning industry collaborations (e.g., BAe Systems, Rolls Royce) and government advisory roles (EPSRC Peer Review College, UK Research Excellence Framework).

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James S. Cottonمشاهده پروفایل

استاد

McMaster UniversityCanada

Professor James S. Cotton is a faculty member in the Department of Mechanical Engineering at McMaster University , specializing in Thermo-Fluid Sciences with a focus on energy sustainability and thermal management. Current research explores thermal energy harvesting , non-thermal plasma flue gas cleaning , and smart electrohydrodynamic heat exchangers . Active in community energy planning as a member of the Burlington Climate Action Plan (2019-2021) and Green Venture board (2016-2021). Research spans both fundamental and applied domains, including two-phase flow , electrohydrodynamic heat transfer modulation , and flow accelerated corrosion analysis. His work integrates modeling and experimental validation for real-world thermal systems. Scientific Contributions: Developed two novel patents for advanced thermal management and soot removal systems during his industrial career at Dana Corp. (until 2007). Current projects involve community energy corridors and next-generation sustainable energy solutions , including the 2025 Hamilton Energy Harvesting Study . Active mentor in graduate education, teaching courses like MECH ENG 4O04: Sustainable Energy Systems and MECH ENG 708: Two Phase Flow and Heat Transfer .

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Srikanth Rangarajanمشاهده پروفایل

استادیار

Binghamton University SUNYUnited States

Srikanth Rangarajan is an Assistant Professor at Binghamton University's School of Systems Science and Industrial Engineering. He holds a PhD and MS from the Indian Institute of Technology Madras (2017) and a BE from Anna University Chennai (2011). His research focuses on energy storage systems, thermal management of electronics, battery optimization, and digital twinning. He previously served as an Associate Research Professor in Mechanical Engineering at Binghamton under Bahgat Sammakia. Rangarajan authored the book Phase Change Material Heat Sinks: A multi-objective Perspective and holds a patent for a rotatable heat sink design. His teaching includes optimization techniques, thermal modeling, and neural networks. Recent work explores virus spread modeling via genetic algorithms, with a preprint under review in Journal of Healthcare Informatics . He has received multiple awards including an Institute Post-Doctoral Fellowship and Research Assistantships from the Indian government. His research bridges thermal engineering with advanced manufacturing and sustainability, addressing challenges in high-power electronics and data center cooling. Education: BE in Mechanical Engineering, Anna University (2011) MS in Thermal Engineering, IIT Madras (2017) PhD in Heat Transfer, IIT Madras (2017) Research Interests: Digital twin systems for battery optimization Thermal energy storage design Advanced electronics packaging Data center cooling innovations Phase change material composites His recent articles highlight cooling solutions for high-density electronics, battery recycling challenges, and predictive models for epidemiological patterns using computational methods. Ongoing work includes embedded cooling technologies for heterogeneous integrated circuits and sustainable thermal management strategies. Awards: Patent: Rotatable Heat Sink (Government of India) Institute Post-Doctoral Fellowship (IIT Madras, 2017) Research Associate, Divecha Centre (IISc, 2017) Half-Time Research Assistantship (MHRD, 2012-2013) Advising & Grants: While no formal advisees are listed, his prior roles indicate involvement in mentorship. His research has been supported by institutional grants including those from the Indian Ministry of Human Resource Development. Labs/Teams: Active in Binghamton's Systems Science and Industrial Engineering lab, collaborating on thermal management and additive manufacturing projects.

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Mircea R. Stanمشاهده پروفایل

استاد

University of VirginiaUnited States

Mircea R. Stan is a Professor of Electrical and Computer Engineering at the University of Virginia, serving as Director of Computer Engineering and Virginia Microelectronics Consortium (VMEC) Professor. He leads the High-Performance Low-Power (HPLP) lab and is an associate director of the Center for Automata Processing (CAP). His research focuses on AI hardware, Processing in Memory, Low Power Design, Cyber-Physical Systems, and Spintronics. Education: Ph.D. (1996) and M.S. (1994) from UMass Amherst; Diploma (1984) from Politehnica University, Bucharest. Research interests include energy-efficient computing architectures, IoT systems, and emerging technologies like magnetic skyrmions and memristors. He has pioneered work on asynchronous stochastic computing, thermal-aware microarchitecture, and microfluidic cooling for 3D-ICs. Key awards include the 2024 A. Richard Newton Technical Impact Award, 2018 ISCA Influential Paper Award, and IEEE Fellow (2014). He has held editorial roles at IEEE TVLSI, IEEE TNano, and IEEE Design & Test. Notable contributions include the HPLP lab’s advancements in low-power logic computing, the VCRFID framework for Industry 4.0, and thermal-aware design tools like Hot-LEGO and Cool-3D.

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