- Heterogeneous Integration
- Electrical and Photonic Interconnects
- Thermal Modeling for Electronics
- +۳ مورد دیگر
Muhannad S. Bakir is the Dan Fielder Professor in the School of Electrical and Computer Engineering at Georgia Institute of Technology, and Director of the 3D Systems Packaging Research Center . His research focuses on heterogeneous integration , electrical/photonic interconnects , thermal modeling , and electronics for healthcare , with over 180 publications and 12 U.S. patents. Research areas include: Advanced cooling and power delivery for emerging systems Biosensor-CMOS integration 2.5D/3D IC packaging Polylithic integration technology Nanofabrication for microsystems Scientific accolades include: 2018 IEEE EPS Exceptional Technical Achievement Award 2013 Intel Early Career Faculty Honor Award 2012 DARPA Young Faculty Award 2011 IEEE CPMT Outstanding Young Engineer Award Best paper awards at IEEE ECTC, IITC, and CICC 2020 Georgia Tech Doctoral Thesis Advisor Award His lab explores integrated 3D systems with emphasis on co-design of thermal, power, and electrical networks for machine learning and healthcare applications.









