
Peter Sandborn
استاد · Electronic Packaging and Reliability
University of Maryland, College Parkمعرفی
Peter Sandborn is a Professor of Mechanical Engineering at the University of Maryland, College Park, and holds roles such as Director of the MTech program, Associate Chair for Academic Affairs, and Director of Graduate Studies. He received his Ph.D. from the University of Michigan in 1987. His research focuses on electronic packaging reliability, life-cycle cost analysis, and system sustainment, particularly addressing challenges like technology obsolescence and supply chain management. He has contributed to over 200 publications, including seminal works on Prognostics and Health Management (PHM) and obsolescence-driven design refresh strategies.
Key honors include IEEE Fellow (2014), ASME Fellow (2013), and the 2009 Poole and Kent Teaching Award. His professional memberships span editorial roles in IEEE and ASME journals, conference leadership, and advisory roles on technology roadmaps. Sandborn has pioneered educational initiatives integrating teardown analysis and embedded resistor emulation for teaching cost modeling. His work bridges engineering economics, reliability, and sustainable design, influencing both academic and industrial practices in system sustainment.




