Manfred Dietrich

Manfred Dietrich is a Researcher at TU Dresden's Institute of Precision Engineering and Electronic Design, actively leading EU projects including HyPerStripes (2022-2025) and KI4BoardNet (2022-2025). His work focuses on design automation, IC design, and system design for advanced semiconductor integration.

His educational background includes:

• 1970-1974: Dipl.-Ing in Information Technology, TU Dresden
• 1981: Promotion (PhD) on 'Fault localization in analog circuits'

Dr. Dietrich's research centers on 3D/2.5D integration challenges, particularly interposer-based memory interfaces, thermal management of stacked systems, and Wide IO implementations. His methodologies address critical bottlenecks in signal integrity, power delivery, and design verification for next-generation semiconductor packaging.

Publications from 2014-2016 demonstrate consistent focus on thermal optimization of 3D systems and XML-based design rule checking, establishing foundational work for current EU projects targeting high-performance computing architectures.

Scientific awards: None documented.

With extensive grant leadership including ECSEL's Microprince project (2017-2020) and current EU supervision roles, his portfolio reflects significant funding acquisition expertise. No student advisees are listed in available records.

He actively contributes to industry standards through memberships in VDE's ITG/GMM groups, the GI/VDE 'Computer-aided circuit and system design' cooperation, and as an ECSEL Strategic Research Group expert.