Heming Cui

Dr. Heming Cui is an Associate Professor at the Department of Computer Science, University of Hong Kong, affiliated with the School of Computing and Data Science. He joined HKU in 2015 after completing his PhD at Columbia University, following bachelor's and master's degrees from Tsinghua University. His research focuses on distributed systems, operating systems, and high-performance computing, with a strong emphasis on reliability and security. Dr. Cui leads projects in distributed AI training systems, blockchain frameworks, and secure execution environments, collaborating closely with industries like Huawei.

He has received notable awards including the Croucher Innovation Award (2016), HK$5 million RGC Research Impact Fund (2023), and best paper awards at ICSE and ACSAC. His work has led to commercialized systems such as Huawei's MindSpore integration of Fold3D and TICS' UTEE component derived from his secure systems research. Dr. Cui actively recruits PhD students specializing in systems security and database systems, prioritizing candidates with strong systems-building backgrounds.

Key grants include leadership in projects totaling HK$30 million, including flagship collaborations with Huawei and RGC grants targeting transaction/analytical processing in edge computing and cloud security. His research spans over 50 publications in top venues like SOSP, NSDI, and IEEE journals, emphasizing reproducibility and industrial impact.