Douglas C. Hopkins

Douglas C. Hopkins is a Research Professor and Director of the Laboratory for Packaging Research in Electronic Energy Systems (PREES) at North Carolina State University's Department of Electrical and Computer Engineering. He joined the ECE faculty in 2011 and is affiliated with the FREEDM Systems Center and the Center for Additive Manufacturing and Logistics (CAMAL). He holds a Ph.D. in Electrical Engineering from Virginia Tech (1989).

His research focuses on Very High-Frequency power electronics, Wide Band Gap (WBG) devices (GaN/SiC), advanced packaging, and solid-state protection systems. He has pioneered work in integrated power electronics, harsh-environment systems, and 3D power electronics integration. His leadership includes founding conferences such as the International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM) and the International Symposium on Advanced Power Electronics Packaging (APEPS).

Prof. Hopkins has authored over 200 publications and co-founded DensePower, LLC as CEO/CTO. He serves as Associate Editor for the IEEE Journal of Emerging and Selected Topics in Power Electronics and holds editorial roles in multiple journals. His awards include the IMAPS Outstanding Educator Award (2013) and IMAPS Fellow (2007).

He has held visiting appointments at the Army Research Lab, NASA, and Lawrence Livermore National Lab, and served as a National Academy of Sciences reviewer. His consulting firm, DCHopkins & Associates, LLC, provides engineering expertise in power electronics and packaging.

Key Contributions:

• Director of PREES Lab and FREEDM Center member
• Co-founder of 3D-PEIM and APEPS symposiums
• IEEE PELS Technical Committee member (TC2, TC-6)
• Recipient of IMAPS Fellow and multiple conference recognitions