معرفی
Dr. Daniel Chung is an Associate Professor of Building Science at the University of Toronto's John H. Daniels Faculty of Architecture, Landscape, and Design. A registered architect and professional engineer with over 20 years of experience, he focuses on improving building performance and resilience through hygrothermal envelope analysis and material testing. His educational background spans architecture, civil engineering, and environmental design from Yale, Drexel, Princeton, and the University of Pennsylvania.
- Ph.D., Architectural Engineering, Drexel University (2019)
- M.Arch., Yale University (2006)
- M.S.E., Civil & Environmental Engineering, Princeton University (2000)
- B.A. & B.S.E., University of Pennsylvania (1998)
Chung's research examines building envelope performance under climate change, emphasizing stochastic modeling, degradation analysis, and biogenic material properties. His lab investigates moisture dynamics in retrofitted assemblies and develops simulation tools like HAM-Tools. Current projects include NSERC-funded retrofit solutions, equitable low-carbon housing initiatives, and Canada Mortgage and Housing Corporation collaborations.
Dr. Chung teaches advanced building envelope systems, architectural design studios, environmental systems, and materials/construction courses. He actively mentors graduate students in physical sciences, building physics, and engineering disciplines.
