Shenyi LiuView profile
Researcher
Shenyi Liu is a Doctoral Researcher at Aalto University's Department of Electrical Engineering and Automation , focusing on advanced semiconductor packaging and reliability engineering. Active in the Electronics Integration and Reliability research group, Liu contributes to developing innovative interconnect solutions for MEMS and power electronics. Email: shenyi.liu@aalto.fi Research Interests center on low-temperature bonding technologies , 3D packaging architectures , and failure mechanism analysis in electronic components. Key methodologies include solid-liquid interdiffusion (SLID) bonding and thermal-mechanical stress characterization. Publication Trends show expertise in MEMS integration , interconnect reliability , and power component packaging , with recent work addressing TSV interconnects, die-attach fatigue cracks, and Cu-Sn-In bonding systems. Collaborations span materials engineering and applied physics domains.


