Vesa VuorinenView profile
Senior Lecturer
Vesa Vuorinen is a Senior Lecturer at the Department of Electrical Engineering and Automation, Aalto University. His research focuses on low-temperature bonding technologies, microsystem packaging, and reliability of electronic components. He leads investigations into solid-liquid interdiffusion (SLID) bonding for 3D MEMS integration, electromigration in microbumps, and interfacial reliability in advanced packaging. Key contributions include developing novel interconnect solutions for 2.5/3D integration, analyzing thermal cycling effects on IGBT modules, and advancing ceramic-metal bonding for biomedical applications. His work bridges material science with practical microelectronic manufacturing challenges. Selected publications (2023–2025) highlight advancements in SLID-TSV interconnects, Cu-Sn-In alloy performance, and fatigue crack network analysis. Collaborations span academic-industrial partnerships in Finland and internationally. Research is published in top journals like IEEE Transactions on Components, Packaging and Manufacturing Technology, and Materials Characterization.






