Jeehwan Kim

Jeehwan Kim is an Associate Professor in Mechanical Engineering and Materials Science and Engineering at MIT. He joined the Mechanical Engineering faculty in 2015 and became a joint faculty member in DMSE in 2016. His research focuses on nanotechnology for computing/electronics, electronic/photonic devices, neuromorphic computing, and heterogeneous integration. He holds over 100 patents from IBM and has received awards like the Samsung Fellow (2022) and DARPA Director’s Award (2021).

Education: BS (Hongik University), MS (Seoul National University), PhD (UCLA), all in Materials Science and Engineering.

Research Interests: Kim’s group innovates in 2D materials, remote epitaxy, neuromorphic systems, and next-gen electronics. Key areas include monolithic 3D integration, bioelectronic devices, and energy-efficient semiconductors. His work bridges material physics with practical device applications.

Awards:

• Samsung Fellow (2022)
• DARPA Director’s Award (2021)
• Young Faculty Award (2019)
• IBM Faculty Award (2016)
• IBM Master Inventor (2012)

Labs/Teams: Jeehwan Kim Research Group at MIT, focusing on advanced material synthesis and device engineering. Active in cross-disciplinary projects involving AI and semiconductor innovation.