Chu-Ryang Wie

Chu-Ryang Wie is a Professor in the Department of Electrical Engineering at the University at Buffalo's School of Engineering and Applied Sciences. He holds a PhD in Applied Physics from the California Institute of Technology.

His research focuses on semiconductor device reliability under various stress conditions, radiation effects analysis, and quantum visualization techniques. Specialized in X-ray characterization of semiconductor materials using reciprocal space mapping, his work advances understanding of device degradation mechanisms and material properties.